# US 7,745,237 B2 · Pattern forming method and pattern forming system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,745,237 B2 - Document ID: US7745237B2 - Status: Granted - Kind: B2 - Application number: 11/626,402 - Filed: 2007-01-24 - Published: 2007-07-26 - Granted: 2010-06-29 - Earliest claimed: 2006-01-24 - Assignees: Hitachi, Ltd. - Inventors: Souichi Katagiri; Yasunari Sohda; Masahiko Ogino - Web page: https://patentgrep.com/patent/US7745237B2 ## CPC - G03F 9/7049: {Technique, e.g. interferometric} - B82Y 10/00: Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic - B82Y 40/00: Manufacture or treatment of nanostructures - G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping} - G03F 9/703: {Gap setting, e.g. in proximity printer} - G03F 9/7084: {Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels} - G03F 9/7088: {Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES ## Abstract Method of forming a pattern by a nanoimprint technique starts with preparing a mold with nanostructures on its surface. The mold is pressed against a substrate or plate coated with a resin film. The positions of alignment marks formed on the rear surface of the plate coated with the resin film are detected. Thus, a relative alignment between the mold and the plate coated with the resin film is performed. ## Claims ### Claim 1 A pattern forming method for forming a pattern by pressing a mold with nanostructures on its surface against a plate coated with a resin film by the use of nanoimprinting, said method comprising the steps of: performing a relative alignment between the mold and the plate coated with the resin film by detecting positions of alignment marks formed on a rear surface of the plate coated with the resin film; measuring a distance between the mold and the plate coated with the resin film; stopping the mold immediately before it comes into contact with the plate coated with the resin film; aligning a relative position between the mold and the plate coated with the resin film within a plane in which the nanostructures will be formed; and pressing the mold against the plate coated with the resin film while maintaining the relative position. ### Claim 2 (depends on 1) A pattern forming method as set forth in claim 1, wherein said step of measuring a distance between the mold and the plate coated with the resin film is carried out by illuminating the alignment marks that assume a line-and-space pattern formed on the mold with a beam arising from a light source made of a laser with a given periodic pitch and determining the distance of the mold to the plate coated with the resin film using zeroth-order diffraction light out of diffraction light reflected from the alignment marks. ### Claim 3 A pattern forming method for forming a pattern by pressing a mold with nanostructures on its surface against a plate coated with a resin film by the use of nanoimprinting, said method comprising the steps of: performing a relative alignment between the mold and the plate coated with the resin film by detecting positions of alignment marks formed on a rear surface of the plate coated with the resin film; measuring a distance between the mold and the plate coated with the resin film at plural positions; stopping the mold immediately before it comes into contact with the plate coated with the resin film; aligning the relative position between the mold and the plate coated with the resin film within a plane in which the nanostructures will be formed into a given relationship; and pressing the mold against the plate coated with the resin film while maintaining the relative position and securing parallelism between the mold and the plate based on the distance between the mold and the plate measured at the plural positions. ### Claim 4 (depends on 1) A pattern forming method as set forth in claim 1, wherein the mold is pressed against the plate according to a difference of pressure produced between above and below the mold. ### Claim 5 A pattern forming method for forming a pattern by pressing a mold with nanostructures on its surface against a plate coated with a resin film by the use of nanoimprinting, said method comprising the steps of: performing a relative alignment between the mold and the plate coated with the resin film by detecting positions of alignment marks formed on a rear surface of the plate coated with the resin film; wherein positions on a front surface of the plate which correspond to positions on a rear surface of the plate are detected by finding a phase difference (φ) between beams of light illuminating at least two points of the alignment marks formed on the rear surface of the plate. ### Claim 6 A pattern forming system for forming a pattern by pressing a mold with nanostructures on its surface against a plate coated which a resin film by the use of nanoimprinting, said pattern forming system comprising: means for pressing the mold against the plate coated with the resin film; and means for performing a relative alignment between the mold and the plate coated with the resin film within a plane in which the nanostructures will be formed by detecting positions of alignment marks formed on a rear surface of the plate coated with the resin film; means for measuring a distance between the mold and the plate coated with the resin film; and means for applying a load while maintaining the position of the mold relative to the plate coated with the resin film within the plane in which the nanostructures will be formed. ### Claim 7 (depends on 6) A pattern forming system as set forth in claim 6, wherein the means for measuring a distance between the mold and the plate coated with the resin film are provided in plural locations, and wherein there is further provided means for applying a load while maintaining the mold and the plate coated with the resin film in a parallel relationship and maintaining the position of the mold relative to the plate coated with the resin film within the plane in which the nanostructures will be formed. ### Claim 8 (depends on 6) A pattern forming system as set forth in claim 6, wherein the means for pressing the mold against the plate coated with the resin film applies pressure by making use of a difference of pressure produced between above and below the mold. ### Claim 9 A pattern forming system for forming a pattern by pressing a mold with nanostructures on its surface against a plate coated which a resin film, said pattern forming system comprising: a plate stage for holding the plate coated with the resin film; stage-driving means capable of moving the plate stage into a given position; a mold stage for holding the mold; rear surface position detectors for detecting positions of alignment marks formed on a rear surface of the plate coated with the resin film; a mold position detector for detecting a position of a plane in which the nanostructures will be formed on the mold; and means for performing a relative alignment between the plate and the mold based on results of the detections performed by the rear surface detectors and mold position detector. ### Claim 10 (depends on 9) A pattern forming system as set forth in claim 9, wherein the mold position detector has a function of detecting a position of the mold in a heightwise direction. ### Claim 11 (depends on 9) A pattern forming system as set forth in claim 9, wherein (A) the mold has alignment marks for alignment, (B) the alignment marks can be detected optically through the mold, and (C) reflected light from the alignment marks is reflected substantially from the alignment marks and does not transmit through the alignment marks. ### Claim 12 (depends on 11) A pattern forming system as set forth in claim 11, wherein the alignment marks formed on the mold assume a line-and-space pattern. ### Claim 13 (depends on 11) A pattern forming system as set forth in claim 11, wherein a reflective film is formed on the alignment marks that are formed on the mold. ### Claim 14 (depends on 9) A pattern forming system as set forth in claim 9, wherein said mold position detector has (a) means for illuminating the mold with light for position detection, (b) a spatial filter for selecting only ± first-order diffraction light out of diffraction light reflected from the alignment marks formed on the mold in response to the light illuminating the mold, the light being for position detection, (c) a spatial filter for selecting only zeroth-order diffraction light, and(d) an optical element for guiding the +first-order diffraction light and the zeroth-order diffraction light to different means of photodetector. ### Claim 15 (depends on 9) A pattern forming system as set forth in claim 9, wherein there is further provided a chip for calibration, the chip being used to constitute a reference position for the rear surface position detectors and for the mold position detector. ### Claim 16 (depends on 9) A pattern forming system as set forth in claim 9, further comprising: a mold upper part chamber and a stage chamber disposed respectively above and below the mold; and means for pressing the mold against the plate by making use of a difference of pressure produced between the upper and lower chambers. ### Claim 17 (depends on 9) A pattern forming system as set forth in claim 9, further comprising: means for measuring a gap between the mold and the plate at plural locations; gap position control means: and load control means.