Thermally conducting foam interface materials
Assignee3M Innovative Properties Company
InventorsPatrick J. Fischer, James J. Kobe, Cameron T. Murray
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Abstract
In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film.
Claims18
A foam thermal interface material comprising a foamed pressure sensitive adhesive film, the foamed pressure sensitive adhesive film comprising a blend of an acrylic polymeric hot melt PSA matrix having a number average molecular weight of greater than 25,000 and a viscosity from 2215 to 3981 Poise, and at least 40 percent by weight of thermally conductive filler comprising boron nitride and/or silicone carbide, said foamed film having a void volume greater than about 12 percent of the volume of said foamed film.
Dependencies are inferred from the claim text.