# US 7,744,984 B2 · Method of treating substrates for bonding > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,744,984 B2 - Document ID: US7744984B2 - Status: Granted - Kind: B2 - Application number: 11/427,023 - Filed: 2006-06-28 - Published: 2008-01-03 - Granted: 2010-06-29 - Earliest claimed: 2006-06-28 - Assignees: Ford Global Technologies, LLC - Inventors: Larry Haack; Ann Straccia; Joe Holubka - Web page: https://patentgrep.com/patent/US7744984B2 ## CPC - C03C 27/048: {consisting of an adhesive specially adapted for that purpose} - C03C 17/04: by fritting glass powder - C03C 23/006: {by plasma or corona discharge} - C03C 23/0075: {Cleaning of glass (specially adapted to plate glass B08B11/00)} - C03C 27/044: {of glass, glass-ceramic or ceramic material only} - B05B 13/0421: {with rotating spray heads} - Y10T 428/24926: including ceramic, glass, porcelain or quartz layer - C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS - B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES (spray-mixers with nozzles B01F25/72; processes for applying liquids or other fluent materials to surfaces by spraying B05D) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method of treating a glass substrate for bonding. The method includes providing a glass substrate having a fritted portion of a ceramic frit material and a non-fritted portion. At least a portion of the fritted portion includes a bondable surface. The method further includes cleaning and activating the bondable surface for subsequent bonding. The cleaning and bonding steps are carried out by applying an air plasma to the bondable surface. ## Claims ### Claim 1 A method of treating a glass substrate for bonding, the method comprising: providing a glass substrate having a fritted portion of a ceramic frit material and a non-fritted portion, wherein at least a portion of the fritted portion comprises a bondable surface; cleaning the bondable surface for subsequent bonding, the bondable surface portion including a bismuth-based ceramic frit material having a hydroxyl content of greater than 15.0 weight percent after cleaning and activating the bondable surface for subsequent bonding, wherein the cleaning and activating steps are carried out by applying an air plasma to the bondable surface. ### Claim 2 (depends on 1) The method of claim 1, wherein the bondable surface includes a contaminant layer and the cleaning step at least partially removes the contaminant layer. ### Claim 3 (depends on 2) The method of claim 2, wherein the contaminant layer comprises a slip coat composition. ### Claim 4 (depends on 3) The method of claim 3, wherein prior to the cleaning step, the contaminant layer has an atomic concentration of Si as silicone of greater than or equal to 11.6 percent and after the cleaning step, the contaminant layer has an atomic concentration of Si as silicone of greater than or equal to 5.0 percent. ### Claim 5 (depends on 1) The method of claim 1, further comprising: selecting an adhesive composition based on the ceramic frit material; and bonding the adhesive composition to the bondable surface of the glass substrate. ### Claim 6 (depends on 5) The method of claim 5, further comprising: providing a second substrate; and bonding the second substrate to the adhesive composition. ### Claim 7 A pretreated fritted glass substrate for use in subsequent bonding, the substrate comprising: a substrate having a fritted portion, the fritted portion including a bondable surface portion, the bondable surface portion including a bismuth-based ceramic frit material having a hydroxyl content of greater than 15.0 weight percent; and a contaminant layer at least partially contacting the bondable surface portion of the substrate, the contaminant layer having an atomic concentration percentage of Si as silicone of greater than zero and less than 5.0 percent. ### Claim 8 (depends on 7) The pretreated fritted glass substrate of claim 7, wherein the atomic concentration percentage of Si as silicone is greater than zero and less than 2.5 percent. ### Claim 9 (depends on 7) The pretreated fitted glass substrate of claim 7, wherein the contaminant layer is comprised of a slip coat composition. ### Claim 10 (depends on 7) The pretreated fitted glass substrate of claim 7, further comprising an adhesive layer at least partially contacting the contaminant layer. ### Claim 11 A method of providing a glass substrate for bonding to a frame, the method comprising: providing a glass substrate having a fritted portion of a bismuth-based ceramic frit material and a non-fritted portion; directing an air plasma onto the surface of the fritted portion, the ceramic frit material having a hydroxyl content of greater than 15.0 weight percent after the air plasma and applying an adhesive to the fritted portion for subsequent bonding to the frame. ### Claim 12 (depends on 11) The method of claim 11, wherein the directing step includes cleaning the fitted portion for subsequent bonding of the adhesive. ### Claim 13 (depends on 9) The pretreated fitted glass substrate of claim 9, wherein the slip coat composition contains silicone. ### Claim 14 (depends on 9) The pretreated fitted substrate of claim 9, wherein the slip coat composition of the contaminant layer has an atomic percentage ratio between carbon and oxygen (C/O) of greater than zero and smaller than 1. ### Claim 15 (depends on 9) The pretreated fitted substrate of claim 9, wherein the slip coat composition of the contaminant layer has an atomic percentage ratio between carbon and oxygen (C/O) of greater than zero and smaller than 0.5. ### Claim 16 (depends on 7) The pretreated fritted glass substrate of claim 7, wherein the fitted portion is a ceramic frit. ### Claim 17 (depends on 16) The pretreated fitted glass substrate of claim 16, wherein the contaminant layer has an atomic percentage ratio between carbon and oxygen (C/O) of greater than zero and smaller than 1.