# US 7,744,947 B2 · Method of forming carbon nanotube on semiconductor substrate, method of forming semiconductor metal wire using the same, and method of fabricating inductor using the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,744,947 B2 - Document ID: US7744947B2 - Status: Granted - Kind: B2 - Application number: 11/461,086 - Filed: 2006-07-31 - Published: 2010-05-27 - Granted: 2010-06-29 - Earliest claimed: 2005-08-31 - Assignees: Korea Advanced Institute of Science and Technology - Inventors: Byung Chul Lee; Jeong Oen Lee; Yang Kyu Choi; Jun-Bo Yoon - Web page: https://patentgrep.com/patent/US7744947B2 ## CPC - H10W 20/056: {by filling conductive material into holes, grooves or trenches} - B81C 99/0085: {using moulds and master templates, e.g. for hot-embossing} - B82Y 10/00: Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic - H10K 85/221: {Carbon nanotubes} - H10W 20/063: {by forming conductive members before forming protective insulating material} - H10W 20/4462: {Carbon or carbon-containing materials, e.g. graphene} - H10W 20/496: {Capacitor integral with wiring layers} - H10W 20/497: {Inductive arrangements or effects of, or between, wiring layers} - B81B 2203/04: Electrodes - B81B 2207/07: Interconnects - B81C 2201/034: Moulding - H01F 41/041: {Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00)} - H10W 20/0554: {of nanotubes or nanowires} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ## Abstract A method of fabricating a semiconductor device by filling carbon nanotubes in a recess is disclosed. The method of fabricating the semiconductor device comprises patterning a mold on a substrate, coating carbon nanotubes on an entire surface of the recess and the mold formed by the patterning, filling the carbon nanotubes coated on the an entire surface of the mold in the recess, and removing the mold. ## Claims ### Claim 1 A method of forming carbon nanotubes on a substrate, comprising: (a) patterning a mold on an upper surface of the substrate to form a recess; (b) coating carbon nanotubes on an upper surface of the recess and an upper surface of the mold; (c) filling the carbon nanotubes that are coated on the upper surface of the mold in the recess by using a flattening tool; and (d) removing the mold. ### Claim 2 (depends on 1) The method of claim 1, wherein the carbon nanotubes are distributed in a predetermined solvent. ### Claim 3 (depends on 2) The method of claim 2, wherein the solvent is made of one of water, acetone, ethanol, methanol, isopropyl alcohol, and butyl cellosolve acetate. ### Claim 4 (depends on 1) The method of claim 1, wherein the carbon nanotubes are distributed in a solvent, and the solvent is dried after step (b). ### Claim 5 (depends on 1) The method of claim 1, further comprising: injecting a liquid into the recess; and evaporating the liquid, after the step (c). ### Claim 6 (depends on 5) The method of claim 5, wherein the liquid is one of water, acetone, ethanol, methanol, isopropyl alcohol, and butyl cellosolve acetate. ### Claim 7 A method of forming semiconductor metal wire using carbon nanotubes, comprising: (a) patterning a first mold to form a recess on an upper surface of a substrate and forming a first metal on the substrate in which the first mold is patterned; (b) coating carbon nanotubes on an upper surface of the first metal; (c) filling the carbon nanotubes that are coated on the upper surface of the first metal in the recess, and forming a second mold on the upper surface of the first metal; (d) plating a second metal on an upper surface of a carbon nanotube structure filled in the recess; and (e) removing the first mold, the second mold, and the first metal. ### Claim 8 (depends on 7) The method of claim 7, wherein the carbon nanotubes are dispersed in a predetermined solvent. ### Claim 9 (depends on 7) The method of claim 7, wherein the second metal is electrically connected to the first metal by the step (d). ### Claim 10 (depends on 7) The method of claim 7, wherein the plating is performed using a process of filling the carbon nanotube structure with a metal or a process of covering the carbon nanotube structure. ### Claim 11 (depends on 7) The method of claim 7, wherein the first and second molds have the same shape. ### Claim 12 A method of fabricating an inductor using carbon nanotubes, comprising: (a) forming a first metal on an upper surface of a substrate, and then patterning a first mold on an upper surface of the first metal to form a recess and a via hole; (b) plating the inside of the via hole with a second metal; (c) forming a third metal on the substrate that is formed by the step (b); (d) coating carbon nanotubes on the substrate that is formed by the step (c), then filling the coated carbon nanotubes in the recess to form a carbon nanotube structure, and injecting a liquid in the recess; (e) patterning a second mold on the substrate that is formed by the step (d); (f) plating a fourth metal on an upper surface of the carbon nanotube structure; and (g) removing the first mold, the second mold, and the first to third metals, wherein the carbon nanotubes are dispersed in a predetermined solvent. ### Claim 13 (depends on 12) The method of claim 12, wherein the first and second molds have the same shape. ### Claim 14 A method of fabricating an inductor using carbon nanotubes, comprising: (a) patterning a first mold on an upper surface of a substrate to form a recess and a via hole; (b) forming a first metal on the substrate that is formed by the step (a); (c) coating carbon nanotubes on the substrate that is formed by the step (b), then filling the carbon nanotubes in the recess to form a carbon nanotube structure, and injecting a fluid into the recess; (d) forming a second mold on an upper surface of the first metal; (e) plating a second metal on an upper surface of the carbon nanotube structure; and (f) removing the first mold, the second mold, the first metal, and the second metal. ### Claim 15 (depends on 14) The method of claim 14, wherein the first and the second molds have the same shape. ### Claim 16 A method of forming carbon nanotubes on a substrate comprising: (a) patterning a mold on a surface of a substrate to form a recess, the recess exposing a portion of the surface of the substrate; (b) providing carbon nanotubes on the exposed portion of the surface of the substrate and an upper surface of the mold; (c) filling the recess with the carbon nanotubes that are provided on the upper surface of the mold; and (d) removing the mold. ### Claim 17 (depends on 16) The method of claim 16, wherein the carbon nanotubes are provided in a predetermined solvent. ### Claim 18 (depends on 17) The method of claim 17, wherein the solvent is one of water, acetone, ethanol, methanol, isopropyl alcohol, and butyl cellosolve acetate. ### Claim 19 (depends on 17) The method of claim 17, further comprising evaporating the solvent. ### Claim 20 (depends on 16) The method of claim 16, further comprising: injecting a liquid into the recess that is filled with the carbon nanotubes; and evaporating the liquid to densify the carbon nanotubes in the recess. ### Claim 21 (depends on 20) The method of claim 20, wherein the liquid is one of water, acetone, ethanol, methanol, isopropyl alcohol, and butyl cellosolve acetate.