# US 7,744,946 B2 · Organic siloxane resins and insulating film using the same

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- Number: US 7,744,946 B2
- Document ID: US7744946B2
- Status: Granted
- Kind: B2
- Application number: 10/541,844
- Filed: 2004-04-16
- Published: 2006-06-29
- Granted: 2010-06-29
- Earliest claimed: 2003-04-17
- Assignees: LG Chem, Ltd.
- Inventors: Bum-gyu Choi; Min-jin Ko; Byung-ro Ko; Myung-sun Moon; Jung-won Kang; Hye-yeong Nam; Gwi-gwon Kang
- Web page: https://patentgrep.com/patent/US7744946B2

## CPC

- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/50: by carbon linkages
- C09D 183/04: Polysiloxanes
- H10P 14/6342: {Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating}
- H10P 14/665: {Porous materials}
- H10P 14/6686: {the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane}
- H10P 14/6922: {the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC}
- Y10T 428/31663: As siloxane, silicone or silane
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention relates to organic siloxane resins and insulating films using the same. The insulating films are manufactured by using organic siloxane resins, wherein organic siloxane resins are hydrolysis-condensation polymers of silane compounds comprising one or more kinds of hydrosilane compounds. They have superior mechanical properties and a low electric property, and therefore, are properly usable for highly integrated semiconductor devices.

## Claims

### Claim 1

Organic siloxane resins for insulation films having a dielectric constant in the range of 2.24 to 2.48 and a mechanical strength in the range of 6 to 8 GPa, which are condensed polymers, manufactured by a hydrolysis and condensation reaction of only hydrosilane compounds, wherein at least one hydrosilane compound has the following Chemical Formula 1;
HnSiR14−n [Chemical Formula 1]
wherein R1 is independently fluorine, aryl, vinyl, allyl, linear or branched alkyl having 1 to 4 carbon atoms, or alkoxy; and n is an integer of 1 to 3.

### Claim 2 (depends on 1)

Compositions for forming insulating films comprising said organic siloxane resins having a dielectric constant in the range of 2.24 to 2.48 and a mechanical strength in the range of 6 to 8 GPa, manufactured according to claim 1.

### Claim 3 (depends on 1)

A method of forming insulating films using organic siloxane resins comprising the steps of:
a) preparing an organic siloxane resin according to claim 1;
b) dissolving the organic siloxane resin in an organic solvent to prepare a solution;
c) forming an insulating film by coating the solution; and
d) drying and hardening the insulating film formed in the step c) to prepare insulation films having dielectric constant in the range of 2.24 to 2.48 and mechanical strength in the range of 6 to 8 GPa.

### Claim 4 (depends on 3)

The method of forming a insulating film using said organic siloxane resins according to claim 3, further comprising a step, after the above step b), of adding one or more additives selected from the group consisting of organic molecules, water, pH controlling agents, colloidal silica, and surfactants to said solution.

### Claim 5 (depends on 1)

Insulation films using organic siloxane resins manufactured by drying and hardening insulating films formed by coating the solution, which is prepared by dissolving said organic siloxane resins according to claim 1 in an organic solvent, onto a substrate.

### Claim 6 (depends on 1)

Electronic devices comprising insulating films using organic siloxane resins manufactured by drying and hardening of insulating films formed by coating the solution, which is prepared by dissolving said organic siloxane resins according to claim 1 in an organic solvent, onto a substrate.