# US 7,744,718 B2 · Microsystem component and method for gluing microcomponents to a substrate

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- Number: US 7,744,718 B2
- Document ID: US7744718B2
- Status: Granted
- Kind: B2
- Application number: 10/568,755
- Filed: 2004-08-06
- Published: 2006-11-02
- Granted: 2010-06-29
- Earliest claimed: 2003-08-25
- Assignees: Technische Universitaet Braunschweig Carolo-Wilhelmina
- Inventors: Stefan Boehm; Klaus Dilger; Elisabeth Stammen; Frank Mund; Gero Pokar; Jan Wrege
- Web page: https://patentgrep.com/patent/US7744718B2

## CPC

- B81C 3/001: {Bonding of two components}
- C09J 5/06: involving heating of the applied adhesive
- H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}
- H10W 72/0113: {Apparatus for manufacturing die-attach connectors}
- H10W 72/013: {of die-attach connectors}
- H10W 72/30: Die-attach connectors
- B81C 2203/032: Gluing
- H10W 72/073: {of die-attach connectors}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/07339: {hardening the adhesive by cooling, e.g. thermoplastics}
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method for gluing microcomponents to a substrate (1) during the production of microsystem components includes the steps of applying a reactive or non-reactive hot melt type adhesive (5) to the microcomponent (18) and/or the substrate (1), heating the hot melt type adhesive (5), and placing the microcomponent (18) onto the substrate (1). The hot melt type adhesive (5) is on the contact surfaces between the microcomponent (18) and the substrate (1) during and after gluing.

## Claims

### Claim 1

A method for gluing microcomponents to a substrate in the production of microsystem components, comprising:
applying a reactive or nonreactive, pulverulent, hotmelt adhesive as a dispersion through a contoured screen with a result that said hotmelt adhesive is present only selected contact areas on a surface of at least one of a substrate and at least one microcomponent, said hotmelt adhesive not being present on other areas on said surface of said at least one of a substrate and at least one microcomponent, said at least one microcomponent being smaller than 1000 μm, and granules of said reactive or nonreactive, pulverent, hotmelt adhesive having a diameter ranging from 0.5 to 150 μm; and
applying the at least one microcomponent to the substrate by melting the hotmelt adhesive on the contact areas when the hotmelt adhesive is between the at least one microcomponent and the substrate, and bonding the at least one microcomponent to the substrate during cooling of the hotmelt adhesive below its melting point.

### Claim 2 (depends on 1)

The method of claim 1 further comprising a step of afterheating the at least one microcomponent after adhering to the substrate.

### Claim 3 (depends on 2)

The method of claim 2, wherein the afterheating takes place using a focused or global heat source.

### Claim 4 (depends on 1)

The method of claim 1 wherein melting the hotmelt adhesive during the step of applying the at least microcomponent to the substrate is achieved using a laser as a heat source.

### Claim 5 (depends on 1)

The method of claim 1 further comprising a step of preheating of the surface to which hotmelt adhesive is to be applied.

### Claim 6 (depends on 1)

The method of claim 1 wherein said step of applying the at least one microcomponent to the substrate step includes the steps of:
melting of said hotmelt adhesive at said selected contact areas on said surface by irradiating said reactive or nonreactive, pulverant, hotmelt adhesive on the selected contact areas using a focusable heat source; and
removing the reactive or nonreactive, pulverant, hotmelt adhesive not incipiently melted.