# US 7,744,714 B2 · Paste patterns formation method and transfer film used therein

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- Number: US 7,744,714 B2
- Document ID: US7744714B2
- Status: Granted
- Kind: B2
- Application number: 11/602,080
- Filed: 2006-11-20
- Published: 2008-05-22
- Granted: 2010-06-29
- Earliest claimed: 2006-11-20
- Assignees: E.I. du Pont de Nemours and Company
- Inventors: Hideki Akimoto
- Web page: https://patentgrep.com/patent/US7744714B2

## CPC

- H01J 9/02: Manufacture of electrodes or electrode systems
- H01J 9/24: Manufacture or joining of vessels, leading-in conductors or bases
- H05K 3/1258: {by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern}
- H10F 77/211: {for photovoltaic cells}
- C09K 2323/00: Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
- C09K 2323/02: Alignment layer characterised by chemical composition
- C09K 2323/05: Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
- C09K 2323/055: Epoxy
- H01J 2211/36: Spacers, barriers, ribs, partitions or the like
- H05K 2203/0537: Transfer of pre-fabricated insulating pattern
- H05K 2203/0568: Resist used for applying paste, ink or powder
- Y02E 10/50: Photovoltaic [PV] energy
- Y10T 428/24479: including variation in thickness
- Y10T 428/24802: Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Disclosed is a paste pattern formation method comprising the steps of: forming a transfer pattern material on a film base material to prepare a transfer film; sticking the transfer film on a substrate on which a transfer pattern is formed so that the transfer pattern material contacts the substrate; separating the film base material from the transfer pattern material; filling a paste into the transfer pattern depression; solidifying the paste; and removing the transfer pattern material.

## Claims

### Claim 1

A paste pattern formation method comprising the steps of:
applying a transfer pattern on a film base material, wherein said transfer pattern comprises a transfer pattern material and transfer pattern depressions, thus forming a transfer film;
transferring the transfer film, onto a substrate so that the transfer pattern material contacts the substrate and so that the film base material is on the back of the transfer pattern material;
separating the film base material from the transfer pattern material;
applying a paste into the transfer pattern depressions, resulting in a paste pattern adhering to the substrate;
solidifying the paste; and then
removing the transfer pattern material, that is located around the solidified paste on the substrate, leaving only the solidified paste on the substrate.

### Claim 2

A paste pattern formation method comprising the steps of:
applying a transfer pattern material on a film base material;
forming transfer pattern depression(s) in the transfer pattern material, thus forming a transfer film;
transferring the transfer film onto a substrate so that the transfer pattern material contacts the substrate and the film base material is on the back of the transfer pattern material;
separating the film base material from the transfer pattern material;
applying a paste into the transfer pattern depression(s), resulting in a paste pattern adhering on the substrate;
solidifying the paste; and then
removing the transfer pattern material, that is located around the solidified paste on the substrate, leaving the solidified paste on the substrate.

### Claim 3 (depends on 2)

The paste pattern formation method according to claim 2, wherein the transfer pattern depression(s) are patterned with a laser.

### Claim 4 (depends on 2)

The paste pattern formation method according to claim 2, wherein the transfer pattern depression(s) are patterned by photoetching.

### Claim 5 (depends on 2)

The paste pattern formation method according to claim 2, wherein the transfer pattern depression(s) are patterned by press stamping.

### Claim 6 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, wherein the transfer film is adhered by pressure onto the substrate onto which the paste pattern is formed.

### Claim 7 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, wherein the transfer film is adhered with an adhesive onto the substrate onto which a paste pattern is formed.

### Claim 8 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, further comprising a step of, after applying the paste into the transfer pattern depression(s), removing the paste remaining on the transfer pattern material.

### Claim 9 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, wherein the step of applying the paste into the transfer pattern depression(s) and the step of solidifying the paste are repeated two times or more until a predetermined paste pattern height is obtained.

### Claim 10 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, wherein the transfer pattern material is removed by dissolving with water.

### Claim 11 (depends on 10)

The paste pattern formation method according to claim 10, wherein the transfer pattern material comprises a water-soluble resin.

### Claim 12 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, wherein the transfer pattern material is removed by dissolving with an organic solvent.

### Claim 13 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, wherein the transfer pattern material is removed by baking.

### Claim 14 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, wherein the paste pattern is an electrode pattern of a solar cell.

### Claim 15 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, wherein the paste pattern is a wiring pattern of a wiring board.

### Claim 16 (depends on 1, 2)

The paste pattern formation method according to claim 1 or 2, wherein the paste pattern is a barrier rib of a plasma display panel.

### Claim 17 (depends on 11)

The paste formation method according to claim 11, wherein the water-soluble resin is selected from the group consisting of: polyvinyl alcohol, polyvinyl pyrrolidone and carboxymethyl cellulose.