# US 7,744,706 B2 · Solder alloy for bonding oxide material, and solder joint using the same

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- Number: US 7,744,706 B2
- Document ID: US7744706B2
- Status: Granted
- Kind: B2
- Application number: 12/244,481
- Filed: 2008-10-02
- Published: 2009-04-23
- Granted: 2010-06-29
- Earliest claimed: 2007-10-03
- Assignees: Hitachi Metals, Ltd.
- Inventors: Minoru Yamada; Nobuhiko Chiwata; Takayuki Moriwaki
- Web page: https://patentgrep.com/patent/US7744706B2

## CPC

- C03C 27/08: with the aid of intervening metal
- C04B 37/006: {consisting of metals or metal salts}
- C04B 37/026: {consisting of metals or metal salts}
- C04B 2235/96: Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B 2237/12: Metallic interlayers
- C04B 2237/34: Oxidic
- C04B 2237/343: Alumina or aluminates
- C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C04B: LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE {(roofing granules E04D7/005)}; CERAMICS (devitrified glass-ceramics C03C10/00); REFRACTORIES; TREATMENT OF NATURAL STONE

## Abstract

The invention provides a solder alloy for bonding an oxide material, including more than 0% but not more than 1.0% of Mg and the balance being substantially Bi and Sn. Preferably, the alloy includes 0.01 to 0.6% of Mg, 35 to 86% of Bi, and the balance being substantially Sn. The invention can be used for bonding an oxide material, such as bonding glasses to each other. According to the invention, a low-cost solder joint of an oxide material is also provided.

## Claims

### Claim 1

A solder alloy for bonding an oxide material, consisting of, by mass, more than 0.17% but not more than 1.0% of Mg, 44.25-60% of Bi and the balance being Sn and unavoidable impurities.

### Claim 2 (depends on 1)

The solder alloy according to claim 1, wherein the alloy comprises 0.17 to 0.6% of Mg by mass.

### Claim 3 (depends on 1)

The solder alloy according to claim 1, wherein the alloy comprises 0.17 to 0.5% of Mg by mass.

### Claim 4 (depends on 1)

The solder alloy according to claim 1, wherein the oxide material is a glass.

### Claim 5 (depends on 1)

A solder joint wherein the solder alloy as defined in claim 1 is joined to an oxide material.

### Claim 6 (depends on 5)

The solder joint according to claim 5, wherein the oxide material is a glass.