# US 7,744,396 B2 · IC socket and IC socket assembly

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- Number: US 7,744,396 B2
- Document ID: US7744396B2
- Status: Granted
- Kind: B2
- Application number: 11/995,648
- Filed: 2006-07-03
- Published: 2009-11-19
- Granted: 2010-06-29
- Earliest claimed: 2005-07-14
- Assignees: Tyco Electronics Japan G.K.
- Inventors: Hidenori Taguchi; Shinichi Hashimoto
- Web page: https://patentgrep.com/patent/US7744396B2

## CPC

- H05K 7/1007: {with means for increasing contact pressure at the end of engagement of coupling parts}
- H01R 13/2442: {with a single cantilevered beam}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS

## Abstract

An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof is disclosed. The IC socket has an insulating housing that receives the IC package and a plurality of elastic contacts, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package. The IC socket also has a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.

## Claims

### Claim 1

An IC socket for receiving an IC package having a plurality of electrical contacts on a bottom face thereof, comprising:
an insulating housing that receives the IC package;
a plurality of elastic contacts each being cantilevered to extend obliquely from the insulating housing, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package; and
a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.

### Claim 2 (depends on 1)

The IC socket according to claim 1, wherein the IC package abuts an inner wall of the insulating housing while in the accepting position, the inner wall being directionally opposite to a direction in which the IC package is slid as the IC package is pressed down.

### Claim 3 (depends on 1)

The IC socket according to claim 1, the spring member comprising:
a fixing section configured for being press-fit into the insulating housing.

### Claim 4 (depends on 1)

The IC socket according to claim 1, the spring member comprising:
a fixing section configured for being press-fit into the insulating housing; and
an arm section that extend substantially perpendicularly away from the fixing section.

### Claim 5 (depends on 1)

The IC socket according to claim 1, the spring member comprising:
a fixing section configured for being press-fit into the insulating housing;
an arm section that extend substantially perpendicularly away from the fixing section; and
a bent section extending from a free end of the arm section.

### Claim 6 (depends on 5)

The IC socket according to claim 5, wherein the bent section, by contacting the insulating housing, restrains the amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.

### Claim 7 (depends on 5)

The IC socket according to claim 5, wherein the bent section is bent toward the direction the IC package horizontally moves due to the bending of the elastic contacts as the IC package is pressed down.

### Claim 8 (depends on 5)

The IC socket according to claim 5, wherein the bent section is disposed between the IC package and the insulating housing.

### Claim 9

An IC socket assembly comprising an IC package having a plurality of electrical contacts on a bottom face thereof and further comprising an IC socket that receives the IC package, the IC socket comprising:
an insulating housing that receives the IC package;
a plurality of elastic contacts each being cantilevered to extend obliquely from the insulating housing, one end each being secured to the insulating housing, and a remaining end of each contacting at least one of the electrical contacts on the bottom face of the IC package; and
a spring member carried by the insulating housing that determines an accepting position for the IC package being accepted into the insulating housing, and that restrains an amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.

### Claim 10 (depends on 9)

The IC socket assembly according to claim 9, wherein the IC package abuts an inner wall of the insulating housing while in the accepting position, the inner wall being directionally opposite to a direction in which the IC package is slid as the IC package is pressed down.

### Claim 11 (depends on 9)

The IC socket assembly according to claim 9, the spring member comprising:
a fixing section configured for being press-fit into the insulating housing.

### Claim 12 (depends on 9)

The IC socket assembly according to claim 9, the spring member comprising:
a fixing section configured for being press-fit into the insulating housing; and
an arm section that extend substantially perpendicularly away from the fixing section.

### Claim 13 (depends on 9)

The IC socket assembly according to claim 9, the spring member comprising:
a fixing section configured for being press-fit into the insulating housing;
an arm section that extend substantially perpendicularly away from the fixing section; and
a bent section extending from a free end of the arm section.

### Claim 14 (depends on 13)

The IC socket assembly according to claim 13, wherein the bent section, by contacting the insulating housing, restrains the amount of horizontal movement of the IC package caused by bending of the elastic contacts as the IC package is pressed down.

### Claim 15 (depends on 13)

The IC socket assembly according to claim 13, wherein the bent section is bent toward the direction the IC package horizontally moves due to the bending of the elastic contacts as the IC package is pressed down.

### Claim 16 (depends on 13)

The IC socket assembly according to claim 13, wherein the bent section is disposed between the IC package and the insulating housing.