# US 7,744,264 B2 · Semiconductor solid-state light-source module and assembly having the same

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- Number: US 7,744,264 B2
- Document ID: US7744264B2
- Status: Granted
- Kind: B2
- Application number: 12/202,557
- Filed: 2008-09-02
- Published: 2009-05-07
- Granted: 2010-06-29
- Earliest claimed: 2007-11-06
- Assignees: Foxsemicon Integrated Technology, Inc.
- Inventors: Chih-Chung Tsao; Chih-Peng Hsu; Wen-Jang Jiang; Chun-Wei Wang; Chih-Ming Lai; Hung-Kuang Hsu
- Web page: https://patentgrep.com/patent/US7744264B2

## CPC

- F21S 2/005: {of modular construction}
- F21K 9/20: Light sources comprising attachment means
- F21V 19/001: {the light sources being semiconductors devices, e.g. LEDs}
- F21V 19/04: with provision for changing light source, e.g. turret {(auxiliary devices for cleaning, placing, or removing incandescent lamps H01K3/32, fluorescent lamps H01J9/006)}
- H05K 1/14: Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00)
- H05K 1/142: {Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit}
- F21V 23/06: the elements being coupling devices {, e.g. connectors}
- F21Y 2115/10: Light-emitting diodes [LED]
- G02B 6/0068: {Arrangements of plural sources, e.g. multi-colour light sources}
- G02B 6/0073: {Light emitting diode [LED]}
- H05K 2201/048: Second PCB mounted on first PCB by inserting in window or holes of the first PCB
- H05K 2201/09963: Programming circuit by using small elements, e.g. small PCBs
- H05K 2201/10106: Light emitting diode [LED]
- F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21V: FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS

## Abstract

An exemplary semiconductor solid-state light-source module includes a printed circuit board, at least one semiconductor solid state light source mounted on the printed circuit board and a light guide plate optically coupled to the semiconductor solid state light source. The printed circuit board includes a protrusion and a recess. The protrusion is configured for engaging with a recess of the printed circuit board of another similar semiconductor solid-state light-source module.

## Claims

### Claim 1

A semiconductor solid-state light-source module, comprising:
a printed circuit board,
at least one semiconductor solid state light source mounted on the printed circuit board; and
a light guide plate optically coupled to the at least one semiconductor solid state light source, wherein the printed circuit board comprises a first protrusion, a second protrusion, a first recess opposite to the first protrusion, and a second recess opposite to the second protrusion, the first protrusion thereof configured for engaging in the first recess of the printed circuit board of another same semiconductor solid-state light-source module along a first direction, the second protrusion thereof configured for engaging in the second recess of the printed circuit board of another same semiconductor solid-state light-source module along a second direction approximately perpendicular to the first direction;
wherein the printed circuit board further comprises a power interface configured for electrical connection to an external power supply, the power interface being electrically connected to the at least one semiconductor solid state light source;
wherein the semiconductor solid-state light-source module further comprises an external controlling unit, wherein the at least one semiconductor solid state light source comprises a plurality of semiconductor solid state light sources electrically connected in parallel, each of the semiconductor solid state light sources includes a first electrode connected to the external controlling unit, and a second electrode connected to the power interface, and the external controlling unit is configured for controlling on-off states of the semiconductor solid state light sources;
wherein the semiconductor solid-state light-source module further comprises a plurality of controller chips, wherein the first electrode of each semiconductor solid state light source is connected to the external controlling unit by the respective controller chip, and the external controlling unit is configured for controlling the controller chips to control on-off states of the corresponding semiconductor solid state light sources.