# US 7,743,963 B1 · Solderable lid or cover for an electronic circuit > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,743,963 B1 - Document ID: US7743963B1 - Status: Granted - Kind: B1 - Application number: 11/364,607 - Filed: 2006-02-28 - Granted: 2010-06-29 - Earliest claimed: 2005-03-01 - Assignees: Amerasia International Technology, Inc. - Inventors: Kevin Kwong-Tai Chung - Web page: https://patentgrep.com/patent/US7743963B1 ## CPC - H10W 76/60: Seals - H10W 76/134: having other interconnections parallel to the conductive base - H05K 3/341: Surface mounted components - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A solderable cover for solder attachment to an electronic substrate comprises a non-solderable cover defining an attachment pattern, a solderable metal layer in the shape of the attachment pattern, and a layer of adhesive bonding the solderable metal layer to the attachment pattern of the non-solderable cover, wherein the adhesive exhibits bond strength and resiliency sufficient to maintain the solderable metal layer attached to the non-solderable cover when raised in temperature to a melting temperature of a solder. ## Claims ### Claim 1 A solderable cover for attachment to an electronic substrate by solder, said solderable cover comprising: a non-solderable cover member having a surface defining a substantially continuous attachment pattern, wherein said non-solderable cover member is of a material that is not solderable; a solderable metal layer that is continuous and of substantially the same size and substantially the same shape as the continuous attachment pattern; and a layer of adhesive bonding said solderable metal layer to the continuous attachment pattern of said non-solderable cover member, wherein said solderable metal layer remains bonded to said non-solderable cover member by said layer of adhesive when raised in temperature to a melting temperature of a solder, whereby said non-solderable cover member with said solderable metal layer bonded thereto by said layer of adhesive provides said solderable cover. ### Claim 2 (depends on 1) The solderable cover of claim 1 wherein said non-solderable cover member includes an optically transparent cover, an electrically insulating cover, an electrically conductive cover, a planar cover, a domed cover, a cover having a base and a wall defining a cavity, or any combination thereof. ### Claim 3 (depends on 1) The solderable cover of claim 1 wherein the attachment pattern of said non-solderable cover member is planar and: is defined by a continuous edge or by plural contiguous edges; or is in the shape of a rectangle, a square, a polygon, a circle, or any combination thereof; or is defined by a continuous edge or by plural contiguous edges and is in the shape of a rectangle, a square, a polygon, a circle, or any combination thereof. ### Claim 4 (depends on 1) The solderable cover of claim 1 wherein the material of said non-solderable cover member that is not solderable includes formed epoxy, stamped epoxy, cast epoxy, molded epoxy, liquid-crystal polymer, plastic, glass, borosilicate glass, quartz, sapphire, alumina, ceramic, laminated metal and insulating layers, or any combination thereof. ### Claim 5 (depends on 1) The solderable cover of claim 1 wherein said solderable metal layer includes copper, copper alloy, brass, nickel, nickel-plated copper, nickel-plated aluminum, gold, silver, a base metal plated with a noble metal, a base metal plated with a solderable metal, or any combination thereof. ### Claim 6 (depends on 1) The solderable cover of claim 1 wherein said non-solderable cover member includes an optically transparent cover, an electrically insulating cover, an electrically conductive cover, a laminated cover, a formed laminated cover, or any combination thereof. ### Claim 7 (depends on 1) The solderable cover of claim 1 wherein said adhesive comprises a molecularly flexible adhesive. ### Claim 8 (depends on 1) The solderable cover of claim 1 further comprising a layer of solder or solder paste on an exposed surface of said solderable metal layer. ### Claim 9 (depends on 8) The solderable cover of claim 8 in combination with an electronic substrate having a solderable attachment pattern thereon corresponding to the attachment pattern of said non-solderable cover member, wherein said layer of solder or solder paste is reflowed to solder said solderable metal layer of said solderable cover to the solderable attachment pattern of said electronic substrate. ### Claim 10 A solderable cover for attachment to an electronic substrate by solder, said solderable cover comprising: a non-solderable cover member having a base and one or more walls defining a cavity therein, wherein edges of the one or more walls distal the base define a planar continuous attachment pattern, and wherein said non-solderable cover member is of a material that is not solderable; a solderable metal layer that is continuous and of substantially the same size and substantially the same shape as the planar continuous attachment pattern and attached to the edges of the one or more walls of said non-solderable cover member; and a layer of adhesive bonding said solderable metal layer to the planar continuous attachment pattern of said non-solderable cover member, wherein said solderable metal layer remains bonded to said non-solderable cover member by said layer of adhesive when raised in temperature to a melting temperature of a solder, whereby said non-solderable cover member with said solderable metal layer bonded thereto by said layer of adhesive provides said solderable cover. ### Claim 11 (depends on 10) The solderable cover of claim 10 wherein said non-solderable cover member is electrically insulating, electrically conductive, domed, optically transparent, or any combination thereof. ### Claim 12 (depends on 10) The solderable cover of claim 10 wherein the planar attachment pattern of said non-solderable cover member is planar and: is defined by a continuous edge or by plural contiguous edges; or is in the shape of a rectangle, a square, a polygon, a circle, or any combination thereof; or is defined by a continuous edge or by plural contiguous edges and is in the shape of a rectangle, a square, a polygon, a circle, or any combination thereof. ### Claim 13 (depends on 10) The solderable cover of claim 10 wherein the material of said non-solderable cover member that is not solderable includes formed epoxy, stamped epoxy, cast epoxy, molded epoxy, liquid-crystal polymer, plastic, glass, borosilicate glass, quartz, sapphire, alumina, ceramic, laminated metal and insulating layers, or any combination thereof. ### Claim 14 (depends on 10) The solderable cover of claim 10 wherein said solderable metal layer includes copper, copper alloy, brass, nickel, nickel-plated copper, nickel-plated aluminum, gold, silver, a base metal plated with a noble metal, a base metal plated with a solderable metal, or any combination thereof. ### Claim 15 (depends on 10) The solderable cover of claim 10 wherein said adhesive comprises a molecularly flexible adhesive. ### Claim 16 (depends on 10) The solderable cover of claim 10 further comprising a layer of solder or solder paste on an exposed surface of said solderable metal layer. ### Claim 17 (depends on 16) The solderable cover of claim 16 in combination with an electronic substrate having a solderable attachment pattern thereon corresponding to the attachment pattern of said non-solderable cover member, wherein said solder paste or said solder is reflowed to solder said solderable metal layer of said solderable cover to the solderable attachment pattern of said electronic substrate. ### Claim 18 A solderable cover for attachment to an electronic substrate by solder, said solderable cover comprising: a non-solderable planar cover member having an edge or edges defining a periphery, wherein the periphery defines a continuous planar attachment pattern, and wherein said non-solderable planar cover member is of a material that is not solderable; a solderable metal layer that is continuous and of substantially the same size and substantially the same shape as the continuous planar attachment pattern and attached proximate the periphery of said non-solderable planar cover member; and a layer of adhesive bonding said solderable metal layer to the continuous planar attachment pattern of said non-solderable planar cover member, wherein said solderable metal layer remains bonded to said non-solderable planar cover member by said layer of adhesive when raised in temperature to a melting temperature of a solder, wherein said non-solderable cover member with said solderable metal layer bonded thereto by said layer of adhesive provides said solderable cover. ### Claim 19 (depends on 18) The solderable cover of claim 18 wherein said non-solderable planar cover member is electrically insulating, electrically conductive, domed, optically transparent, or any combination thereof. ### Claim 20 (depends on 18) The solderable cover of claim 18 wherein the material of said non-solderable planar cover member that is not solderable includes formed epoxy, stamped epoxy, cast epoxy, molded epoxy, liquid-crystal polymer, plastic, glass, borosilicate glass, quartz, sapphire, alumina, ceramic, laminated metal and insulating layers, or any combination thereof. ### Claim 21 (depends on 18) The solderable cover of claim 18 wherein said solderable metal layer includes copper, copper alloy, brass, nickel, nickel-plated copper, nickel-plated aluminum, gold, silver, a base metal plated with a noble metal, a base metal plated with a solderable metal, or any combination thereof. ### Claim 22 (depends on 18) The solderable cover of claim 18 wherein said adhesive comprises a molecularly flexible adhesive. ### Claim 23 (depends on 18) The solderable cover of claim 18 further comprising a layer of solder or solder paste on an exposed surface of said solderable metal layer. ### Claim 24 (depends on 23) The solderable cover of claim 23 in combination with an electronic substrate having a solderable planar attachment pattern thereon corresponding to the planar attachment pattern of said non-solderable planar cover member, wherein said solder paste or said solder is reflowed to solder said solderable metal layer of said solderable cover to the solderable planar attachment pattern of said electronic substrate.