# US 7,743,619 B1 · Heat exchanger system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,743,619 B1 - Document ID: US7743619B1 - Status: Granted - Kind: B1 - Application number: 11/327,181 - Filed: 2006-01-06 - Granted: 2010-06-29 - Earliest claimed: 2006-01-06 - Assignees: Isothermal Research Systems, Inc. - Inventors: Charles L. Tilton; Philip W. Appel - Web page: https://patentgrep.com/patent/US7743619B1 ## CPC - H05K 7/2069: {within rooms for removing heat from cabinets} - F28D 15/0266: {with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence)} - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - F28D: HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT (fluid heaters having heat generating means and heat transferring means F24H; furnaces F27; details of heat-exchange apparatus of general) ## Abstract A heat exchanger system for efficiently thermally managing coolant within a multiple-phase thermal management system. The heat exchanger system includes a thermal management unit, a release valve within the thermal management unit to release vaporized coolant, and a heat exchanger fluidly connected to the release valve and to the thermal management unit to return liquid coolant to the thermal management unit. ## Claims ### Claim 1 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a thermal management unit; a release valve fluidly connected to said thermal management unit to selectively release a coolant from within said thermal management unit, wherein said coolant is in a substantially vaporized state; and a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said release valve to receive the vaporized coolant and wherein said outlet is fluidly connected to said thermal management unit to return liquid coolant to said thermal management unit; wherein said release valve is opened and closed based upon an environmental condition of said thermal management unit; wherein vaporized coolant is transferred from said thermal management unit to said heat exchanger via a passive transfer system. ### Claim 2 (depends on 1) The thermal management system of claim 1, wherein said thermal management unit includes a spray unit to spray liquid coolant upon the heat producing device. ### Claim 3 (depends on 2) The thermal management system of claim 2, including a pump fluidly connected between said thermal management unit and said spray unit. ### Claim 4 (depends on 1) The thermal management system of claim 1, including a return valve fluidly connected between said heat exchanger and said thermal management unit to control a flow of liquid coolant to said thermal management unit. ### Claim 5 (depends on 4) The thermal management system of claim 4, wherein said return valve is closed when a desired coolant level exists within said thermal management unit. ### Claim 6 (depends on 4) The thermal management system of claim 4, wherein said return valve is open when a desired coolant level does not exist within said thermal management unit. ### Claim 7 (depends on 4) The thermal management system of claim 4, wherein said return valve is opened to approximately replace the coolant vented through said release valve. ### Claim 8 (depends on 1) The thermal management system of claim 1, including a vapor pump fluidly connected between said release valve and said heat exchanger. ### Claim 9 (depends on 1) The thermal management system of claim 1, wherein said release valve is closed when a pressure within said thermal management unit is below a minimum pressure and wherein said release valve is open when a pressure within said thermal management unit is above said minimum pressure. ### Claim 10 (depends on 9) The thermal management system of claim 9, wherein said minimum pressure is a pressure required to cause a flow of the vaporized coolant from said thermal management unit to said heat exchanger. ### Claim 11 (depends on 1) The thermal management system of claim 1, wherein said release valve is closed when a temperature within said thermal management unit is below a minimum temperature and wherein said release valve is open when a temperature within said thermal management unit is above said minimum temperature. ### Claim 12 (depends on 1) The thermal management system of claim 1, including a reservoir fluidly connected between said heat exchanger and said thermal management unit. ### Claim 13 (depends on 12) The thermal management system of claim 12, wherein said reservoir is positioned below said heat exchanger to allow liquid coolant to gravity feed from said heat exchanger to said reservoir. ### Claim 14 (depends on 13) The thermal management system of claim 13, wherein said reservoir is positioned above a floor within said thermal management unit to allow liquid coolant to gravity feed from said reservoir to said thermal management unit. ### Claim 15 (depends on 12) The thermal management system of claim 12, including a return pump fluidly connected between said reservoir and said thermal management unit. ### Claim 16 (depends on 1) The thermal management system of claim 1, including a return pump fluidly connected between said heat exchanger and said thermal management unit. ### Claim 17 (depends on 1) The thermal management system of claim 1, wherein liquid coolant is transferred from said heat exchanger to said thermal management unit via gravity feed. ### Claim 18 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a plurality of thermal management units; a plurality of release valves fluidly connected respectively to said plurality of thermal management units to selectively release a coolant from within said plurality of thermal management units, wherein said coolant is in a substantially vaporized state; and a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said plurality of release valves to receive the vaporized coolant and wherein said outlet is fluidly connected to said plurality of thermal management units to return liquid coolant to said plurality of thermal management units. ### Claim 19 (depends on 18) The thermal management system of claim 18, wherein each of said plurality of thermal management units includes a spray unit to spray liquid coolant upon the heat producing device. ### Claim 20 (depends on 19) The thermal management system of claim 19, wherein each of said plurality of thermal management units includes a pump fluidly connected to said spray unit. ### Claim 21 (depends on 18) The thermal management system of claim 18, including a plurality of return valves fluidly connected between said heat exchanger and said plurality of thermal management units to control a flow of liquid coolant to said plurality of thermal management units. ### Claim 22 (depends on 21) The thermal management system of claim 21, wherein said return valves are closed when a desired coolant level exists within a corresponding thermal management unit. ### Claim 23 (depends on 21) The thermal management system of claim 21, wherein said return valves are open when a desired coolant level does not exist within a corresponding thermal management unit. ### Claim 24 (depends on 21) The thermal management system of claim 21, wherein said return valves are opened to approximately replace the coolant vented through said release valve. ### Claim 25 (depends on 18) The thermal management system of claim 18, wherein vaporized coolant is transferred from said plurality of thermal management units to said heat exchanger via a passive transfer system. ### Claim 26 (depends on 18) The thermal management system of claim 18, including at least one vapor pump fluidly connected between said release valves and said heat exchanger. ### Claim 27 (depends on 16) The thermal management system of claim 16, wherein said release valves are opened and closed based upon an environmental condition of a corresponding thermal management unit. ### Claim 28 (depends on 27) The thermal management system of claim 27, wherein said release valves are closed when a pressure within a corresponding thermal management unit is below a minimum pressure and wherein said release valves are open when a pressure within said corresponding thermal management unit is above said minimum pressure. ### Claim 29 (depends on 28) The thermal management system of claim 28, wherein said minimum pressure is a pressure required to cause a flow of the vaporized coolant from said thermal management unit to said heat exchanger. ### Claim 30 (depends on 27) The thermal management system of claim 27, wherein said release valves are closed when a temperature within a corresponding thermal management unit is below a minimum temperature and wherein said release valves are open when a temperature within said corresponding thermal management unit is above said minimum temperature. ### Claim 31 (depends on 18) The thermal management system of claim 18, including a reservoir fluidly connected between said heat exchanger and said plurality of thermal management units. ### Claim 32 (depends on 31) The thermal management system of claim 31, wherein said reservoir is positioned below said heat exchanger to allow liquid coolant to gravity feed from said heat exchanger to said reservoir. ### Claim 33 (depends on 32) The thermal management system of claim 32, wherein said reservoir is positioned above a floor within each of said plurality of thermal management units to allow liquid coolant to gravity feed from said reservoir to said plurality of thermal management units. ### Claim 34 (depends on 31) The thermal management system of claim 31, including a return pump fluidly connected between said reservoir and said plurality of thermal management units. ### Claim 35 (depends on 18) The thermal management system of claim 18, including a return pump fluidly connected between said heat exchanger and said plurality of thermal management units. ### Claim 36 (depends on 18) The thermal management system of claim 18, wherein liquid coolant is transferred from said heat exchanger to said plurality of thermal management units via gravity feed. ### Claim 37 A thermal management system for thermally managing one or more heat producing devices, comprising: a thermal management unit; a heat exchanger having an inlet and an outlet; and a valve fluidly connected to said thermal management unit, to said inlet and to said outlet, wherein said valve selectively releases substantially vaporized coolant from within said thermal management unit to said heat exchanger and wherein said valve selectively returns liquid coolant from said heat exchanger to said thermal management unit; wherein said valve is comprised of a proportional valve to simultaneously release the vaporized coolant to said heat exchanger and return the liquid coolant from said heat exchanger. ### Claim 38 (depends on 37) The thermal management system of claim 37, wherein a first mass flow rate of the vaporized coolant approximately equals a second mass flow rate of the liquid coolant. ### Claim 39 A method of thermally conditioning coolant within a thermal management unit, said method comprising: accumulating vaporized coolant within a thermal management unit; releasing at least a portion of said vaporized coolant when an internal pressure or an internal temperature within said thermal management unit exceeds a first level; terminating said step of releasing when said internal pressure or said internal temperature is below a second level; returning liquid coolant from a heat exchanger to said thermal management unit until the released vaporized coolant has been substantially replaced. ### Claim 40 A method of thermally conditioning coolant within a thermal management unit, said method comprising: accumulating vaporized coolant within a thermal management unit; releasing at least a portion of said vaporized coolant having a first mass flow rate when an internal pressure within said thermal management unit exceeds a first level; and returning liquid coolant from a heat exchanger to said thermal management unit having a second mass flow rate, wherein said second mass flow rate is substantially equal to said first mass flow rate. ### Claim 41 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a thermal management unit; a release valve fluidly connected to said thermal management unit to selectively release a coolant from within said thermal management unit, wherein said coolant is in a substantially vaporized state; and a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said release valve to receive the vaporized coolant and wherein said outlet is fluidly connected to said thermal management unit to return liquid coolant to said thermal management unit; a return valve fluidly connected between said heat exchanger and said thermal management unit to control a flow of liquid coolant to said thermal management unit, wherein said return valve is closed when a desired coolant level exists within said thermal management unit. ### Claim 42 A thermal management system for thermally managing one or more heat producing devices, comprising: a thermal management unit; a heat exchanger having an inlet and an outlet; and a valve fluidly connected to said thermal management unit, to said inlet and to said outlet, wherein said valve selectively releases substantially vaporized coolant from within said thermal management unit to said heat exchanger and wherein said valve selectively returns liquid coolant from said heat exchanger to said thermal management unit; wherein said valve is comprised of a 3-way valve to release the vaporized coolant to said heat exchanger and to return the liquid coolant from said heat exchanger. ### Claim 43 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a thermal management unit; a release valve fluidly connected to said thermal management unit to selectively release a coolant from within said thermal management unit, wherein said coolant is in a substantially vaporized state; and a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said release valve to receive the vaporized coolant and wherein said outlet is fluidly connected to said thermal management unit to return liquid coolant to said thermal management unit; wherein said release valve is opened and closed based upon an environmental condition of said thermal management unit; a return valve fluidly connected between said heat exchanger and said thermal management unit to control a flow of liquid coolant to said thermal management unit, wherein said return valve is closed when a desired coolant level exists within said thermal management unit. ### Claim 44 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a thermal management unit; a release valve fluidly connected to said thermal management unit to selectively release a coolant from within said thermal management unit, wherein said coolant is in a substantially vaporized state; and a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said release valve to receive the vaporized coolant and wherein said outlet is fluidly connected to said thermal management unit to return liquid coolant to said thermal management unit; wherein said release valve is opened and closed based upon an environmental condition of said thermal management unit; a return valve fluidly connected between said heat exchanger and said thermal management unit to control a flow of liquid coolant to said thermal management unit, wherein said return valve is open when a desired coolant level does not exist within said thermal management unit. ### Claim 45 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a thermal management unit; a release valve fluidly connected to said thermal management unit to selectively release a coolant from within said thermal management unit, wherein said coolant is in a substantially vaporized state; and a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said release valve to receive the vaporized coolant and wherein said outlet is fluidly connected to said thermal management unit to return liquid coolant to said thermal management unit; wherein said release valve is opened and closed based upon an environmental condition of said thermal management unit; a return valve fluidly connected between said heat exchanger and said thermal management unit to control a flow of liquid coolant to said thermal management unit, wherein said return valve is opened to approximately replace the coolant vented through said release valve. ### Claim 46 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a thermal management unit; a release valve fluidly connected to said thermal management unit to selectively release a coolant from within said thermal management unit, wherein said coolant is in a substantially vaporized state; and a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said release valve to receive the vaporized coolant and wherein said outlet is fluidly connected to said thermal management unit to return liquid coolant to said thermal management unit; wherein said release valve is opened and closed based upon an environmental condition of said thermal management unit, wherein said release valve is closed when a pressure within said thermal management unit is below a minimum pressure and wherein said release valve is open when a pressure within said thermal management unit is above said minimum pressure. ### Claim 47 (depends on 46) The thermal management system of claim 46, wherein said minimum pressure is a pressure required to cause a flow of the vaporized coolant from said thermal management unit to said heat exchanger. ### Claim 48 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a thermal management unit; a release valve fluidly connected to said thermal management unit to selectively release a coolant from within said thermal management unit, wherein said coolant is in a substantially vaporized state; and a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said release valve to receive the vaporized coolant and wherein said outlet is fluidly connected to said thermal management unit to return liquid coolant to said thermal management unit; wherein said release valve is opened and closed based upon an environmental condition of said thermal management unit, wherein said release valve is closed when a temperature within said thermal management unit is below a minimum temperature and wherein said release valve is open when a temperature within said thermal management unit is above said minimum temperature. ### Claim 49 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a thermal management unit; a release valve fluidly connected to said thermal management unit to selectively release a coolant from within said thermal management unit, wherein said coolant is in a substantially vaporized state; a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said release valve to receive the vaporized coolant and wherein said outlet is fluidly connected to said thermal management unit to return liquid coolant to said thermal management unit; wherein said release valve is opened and closed based upon an environmental condition of said thermal management unit; and a reservoir fluidly connected between said heat exchanger and said thermal management unit. ### Claim 50 (depends on 49) The thermal management system of claim 49, wherein said reservoir is positioned below said heat exchanger to allow liquid coolant to gravity feed from said heat exchanger to said reservoir. ### Claim 51 (depends on 50) The thermal management system of claim 50, wherein said reservoir is positioned above a floor within said thermal management unit to allow liquid coolant to gravity feed from said reservoir to said thermal management unit. ### Claim 52 (depends on 49) The thermal management system of claim 49, including a return pump fluidly connected between said reservoir and said thermal management unit. ### Claim 53 A thermal management system for thermally managing one or more heat producing electronic devices, comprising: a thermal management unit; a release valve fluidly connected to said thermal management unit to selectively release a coolant from within said thermal management unit, wherein said coolant is in a substantially vaporized state; a heat exchanger having an inlet and an outlet, wherein said inlet of said heat exchanger is fluidly connected to said release valve to receive the vaporized coolant and wherein said outlet is fluidly connected to said thermal management unit to return liquid coolant to said thermal management unit; wherein said release valve is opened and closed based upon an environmental condition of said thermal management unit; and a return pump fluidly connected between said heat exchanger and said thermal management unit.