# US 7,743,503 B2 · Method for manufacturing inkjet head

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- Number: US 7,743,503 B2
- Document ID: US7743503B2
- Status: Granted
- Kind: B2
- Application number: 11/215,974
- Filed: 2005-09-01
- Published: 2006-03-09
- Granted: 2010-06-29
- Earliest claimed: 2004-09-06
- Assignees: Canon Kabushiki Kaisha
- Inventors: Takehito Okabe; Nobuhiko Sato; Makoto Kurotobi; Kenichi Takeda; Toshihiro Ifuku
- Web page: https://patentgrep.com/patent/US7743503B2

## CPC

- B41J 2/161: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/1623: {bonding and adhesion}
- B41J 2/1626: {etching}
- Y10T 29/42: Piezoelectric device making
- Y10T 29/49126: Assembling bases
- Y10T 29/49128: Assembling formed circuit to base
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 29/49401: Fluid pattern dispersing device making, e.g., ink jet
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method for manufacturing an inkjet head includes providing a piezoelectric substrate having a porous structure, a diaphragm on the porous structure, and a piezoelectric substance layer on the diaphragm, and forming a cavity by etching out the porous structure from the piezoelectric substrate.

## Claims

### Claim 1

A method for manufacturing an inkjet head, comprising steps of:
forming an anodization-resistant film on a predetermined area of one surface of a substrate made of single-crystal silicon;
forming a porous structure by making at least a part of an area of the one surface of the substrate on which the anodization-resistant film is not formed porous by an anodization method;
removing the anodization-resistant film;
forming a non-porous single crystal diaphragm on the one surface of the substrate including the porous structure by epitaxial growth;
forming a piezoelectric substance layer on the diaphragm formed on the porous structure;
reducing a thickness of the substrate from a side of another surface of the substrate; and
forming a cavity by etching out the porous structure from the substrate.

### Claim 2 (depends on 1)

The method for manufacturing an inkjet head according to claim 1, wherein the diaphragm is made of silicon.

### Claim 3 (depends on 2)

The method for manufacturing an inkjet head according to claim 2, wherein a concentration of oxygen in the diaphragm is lower than that in the substrate.

### Claim 4 (depends on 1)

The method for manufacturing an inkjet head according to claim 1, wherein the substrate is bonded to a nozzle plate including a nozzle after the cavity is formed in the substrate.

### Claim 5 (depends on 4)

The method for manufacturing an inkjet head according to claim 4, wherein the nozzle in the nozzle plate is connected to the cavity.

### Claim 6 (depends on 4)

The method for manufacturing an inkjet head according to claim 4, wherein the nozzle plate has a coefficient of thermal expansion equal to that of the substrate.

### Claim 7 (depends on 1)

The method for manufacturing an inkjet head according to claim 1, further compromising:
fixing the substrate on a supporting substrate.

### Claim 8 (depends on 1)

A method for manufacturing an inkjet head according to claim 1, wherein the porous structure is formed through the substrate from the area of the one surface on which the anodization-resistant film is not formed to the other surface of the substrate.