# US 7,743,493 B2 · Method for manufacturing a ceramic electronic component > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,743,493 B2 - Document ID: US7743493B2 - Status: Granted - Kind: B2 - Application number: 11/573,691 - Filed: 2005-09-22 - Published: 2007-10-25 - Granted: 2010-06-29 - Earliest claimed: 2004-09-24 - Assignees: Nihon University - Inventors: Fumio Uchikoba - Web page: https://patentgrep.com/patent/US7743493B2 ## CPC - H05K 3/1258: {by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern} - H01C 7/003: {Thick film resistors} - H01C 17/065: by thick film techniques, e.g. serigraphy - H01G 4/005: Electrodes - H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} - H05K 3/207: {using a prefabricated paste pattern, ink pattern or powder pattern} - H01F 41/041: {Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00)} - H01F 41/042: {by thin film techniques} - H01F 41/046: {structurally combined with ferromagnetic material} - H05K 1/092: {Dispersed materials, e.g. conductive pastes or inks} - H05K 2203/0264: Peeling insulating layer, e.g. foil, or separating mask - H05K 2203/0568: Resist used for applying paste, ink or powder - Y10T 29/435: Solid dielectric type - Y10T 29/4902: Electromagnet, transformer or inductor - Y10T 29/49128: Assembling formed circuit to base - Y10T 29/49155: Manufacturing circuit on or in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01C: RESISTORS - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A photo-resist of a dry film patterned to form opening portions and non-opening portions is provided on a release film. An electrically conductive paste is applied by a doctor blade and thereafter is dried. Then, the release film of the dry film is removed and thereafter the dry film is adhered to a ceramic green sheet. The photo-resist is removed from the ceramic green sheet to form an electrically conductive film on the ceramic green sheet. The ceramic electronic component is manufactured by sintering the ceramic green sheet having the electrically conductive film formed. ## Claims ### Claim 1 In a method for manufacturing a ceramic electronic component comprising the steps of forming onto a ceramic green sheet an electrically conductive film having an electrically conductive pattern of said electronic component and of thereafter sintering said ceramic green sheet and said electrically conductive film to form said electronic component, the improvement comprising the steps of providing a photo-resist of a dry film carried on a release film; patterning said photo resist to correspond to said electrically conductive pattern of said electronic component; applying an electrically conductive paste on said patterned photo-resist before or after said dry film is adhered to said ceramic green sheet; removing said release film from said photo-resist of said dry film; drying and solidifying said electrically conductive paste to form said electrically conductive film; and removing said photo-resist of said dry film from said ceramic green sheet to form said electrically conductive film on said ceramic green sheet. ### Claim 2 (depends on 1) A method for manufacturing a ceramic electronic component as set forth in claim 1, wherein a thickness of said photo-resist of said dry film is 5 through 100 μm. ### Claim 3 (depends on 1) A method for manufacturing a ceramic electronic component as set forth in claim 1, wherein a viscosity of said electrically conductive paste is 0.1 through 10 Pa·s in case of applying said electrically conductive paste by a doctor blade and 1 through 100 Pa·s in case of applying said electrically conductive paste by a screen. ### Claim 4 (depends on 3) A method for manufacturing a ceramic electronic component as set forth in claim 3, wherein a viscosity of said electrically conductive paste is 0.5 through 1 Pa·s in case of applying said electrically conductive paste by a doctor blade and 10 through 50 Pa·s in case of applying said electrically conductive paste by a screen. ### Claim 5 (depends on 2) A method for manufacturing a ceramic electronic component as set forth in claim 2, wherein a viscosity of said electrically conductive paste is 0.1 through 10 Pa·s in case of applying said electrically conductive paste by a doctor blade and 1 through 100 Pa·s in case of applying said electrically conductive paste by a screen. ### Claim 6 (depends on 5) A method for manufacturing a ceramic electronic component as set forth in claim 5, wherein a viscosity of said electrically conductive paste is 0.5 through 1 Pa·s in case of applying said electrically conductive paste by a doctor blade and 10 through 50 Pa·s in case of applying said electrically conductive paste by a screen. ### Claim 7 (depends on 1) A method of manufacturing a ceramic electronic component as set forth in claim 1, wherein patterning said photo-resist includes forming spaced non-open. portions defining open portions for receipt of said electrically conductive paste to form said electrically conductive film, adjacent non-open portions including corners on opposite sides of an intermediate open portion, applying said electrically conductive paste on said patterned photo-resist includes applying said electrically conductive paste at a level or height that fills said open portion and extends slightly above said adjacent non-open portions, drying and solidifying said electrically conductive paste includes forming applied paste portions on said non-open portions connected to paste within said open portion and settling said applied paste within said open portion to reduce said level or height and thereby form thinner portions of said electrically conductive paste at said corners. ### Claim 8 (depends on 1) A method for manufacturing a ceramic electronic component as set forth in claim 1, wherein said step of applying said electrically conductive paste on said patterned photo-resist is performed before said dry film is adhered to said ceramic green sheet. ### Claim 9 (depends on 1) A method for manufacturing a ceramic electronic component as set forth in claim 1, wherein said step of applying said electrically conductive paste on said patterned photo-resist is performed after said dry film is adhered to said ceramic green sheet. ### Claim 10 (depends on 8) A method for manufacturing a ceramic electronic component as set forth in claim 8, wherein a thickness of said photo-resist of said dry film is 5 through 100 μm. ### Claim 11 (depends on 9) A method for manufacturing a ceramic electronic component as set forth in claim 9, wherein a thickness of said photo-resist of said dry film is 5 through 100 μm. ### Claim 12 (depends on 8) A method for manufacturing a ceramic electronic component as set forth in claim 8, wherein a viscosity of said electrically conductive paste is 0.1 through 10 Pa·s in case of applying said electrically conductive paste by a doctor blade and 1 through 100 Pa·s in case of applying said electrically conductive paste by a screen. ### Claim 13 (depends on 9) A method for manufacturing a ceramic electronic component as set forth in claim 9, wherein a viscosity of said electrically conductive paste is 0.1 through 10 Pa·s in case of applying said electrically conductive paste by a doctor blade and 1 through 100 Pa·s in case of applying said electrically conductive paste by a screen. ### Claim 14 (depends on 12) A method for manufacturing a ceramic electronic component as set forth in claim 12, wherein a viscosity of said electrically conductive paste is 0.5 through 1 Pa·s in case of applying said electrically conductive paste by a doctor blade and 10 through 50 Pa·s in case of applying said electrically conductive paste by a screen. ### Claim 15 (depends on 13) A method for manufacturing a ceramic electronic component as set forth in claim 13, wherein a viscosity of said electrically conductive paste is 0.5 through 1 Pa·s in case of applying said electrically conductive paste by a doctor blade and 10 through 50 Pa·s in case of applying said electrically conductive paste by a screen. ### Claim 16 (depends on 8) A method of manufacturing a ceramic electronic component as set forth in claim 8, wherein patterning said photo-resist includes forming spaced non-open portions defining open portions for receipt of said electrically conductive paste to form said electrically conductive film, adjacent non-open portions including corners on opposite sides of an intermediate open portion, applying said electrically conductive paste on said patterned photo-resist includes applying said electrically conductive paste at a level or height that fills said open portion and extends slightly above said adjacent non-open portions, drying and solidifying said electrically conductive paste includes forming applied paste portions on said non-open portions connected to paste within said open portion and settling said applied paste within said open portion to reduce said level or height and thereby form thinner portions of said electrically conductive paste at said corners.