# US 7,743,491 B2 · Mounting method of passive component

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 7,743,491 B2
- Document ID: US7743491B2
- Status: Granted
- Kind: B2
- Application number: 11/783,078
- Filed: 2007-04-05
- Published: 2007-10-11
- Granted: 2010-06-29
- Earliest claimed: 2006-04-07
- Assignees: Advaced Semiconductor Engineering, Inc.
- Inventors: Wen-Shin Lin; Wei-Chih Wang
- Web page: https://patentgrep.com/patent/US7743491B2

## CPC

- H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers}
- H05K 3/305: {Affixing by adhesive}
- H05K 3/3494: Heating processes for reflow soldering
- H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor
- H05K 2201/10984: Component carrying a connection agent, e.g. solder, adhesive
- H05K 2203/1476: Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
- Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product
- Y10T 29/49117: Conductor or circuit manufacturing
- Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T 29/49144: by metal fusion
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention relates to a mounting method of passive component, and particularly relates to a mounting method of a small-size passive component. A passive component partially covered by an adhesive material is provided. Before the adhesive layer is melted, the adhesive material is melted and then solidified to form a fixing structure between the passive component and a substrate for fixing the passive component on the substrate. Therefore, the tombstone problem caused by uneven pulling force that the melted solder applies to the two ends of the passive component is effectively solved. The yield rate is increased, and the product loss is reduced.

## Claims

### Claim 1

A mounting method of a passive component, the method comprising:
providing a substrate comprising a pair of contact pads disposed on a surface of the substrate;
forming an electrically conductive adhesive layer on surfaces of the pair of contact pads;
providing a passive component partially covered by an insulative adhesive material, wherein two ends of the passive component are free of coverage by the insulative adhesive material;
placing the passive component on the substrate so that the two ends of the passive component respectively contact the conductive adhesive layer on the contact pads;
heating the insulative adhesive material to a first temperature so that the insulative adhesive material covering the passive component melts, and flows to and contacts the substrate, after the passive component is placed on the substrate;
heating the melted adhesive material to a second temperature higher than the first temperature for solidifying the insulative adhesive material so that the solidified insulative adhesive material fixes the passive component on the substrate; and
performing a reflowing step after the passive component is fixed to the substrate by the solidified insulative adhesive material, wherein the conductive adhesive layer is melted at a third temperature higher than the second temperature and then solidified for bonding and electrically connecting the two ends of the passive component to the contact pads on the substrate, respectively.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the electrically conductive material is a solder paste.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the insulation insulative adhesive material is a molding compound.