Method for the structured application of a laminatable film to a substrate for a semiconductor module
AssigneeInfineon Technologies AG
InventorsThomas Licht, Alfred Kemper
Life of this patent
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Abstract
A method for structured application of a laminatable intermediate layer (9) to a substrate (1) for a semiconductor module, wherein a separating layer is indirectly or directly applied to the substrate (1) over a large surface, the intermediate layer (9) is applied to the substrate (1), including the separating layer(s), by lamination, over a large surface, the intermediate layer (9) is opened in places on the substrate (1), where recesses are provided for the intermediate layer (9), and the separating layer (8) is removed in these places.
Claims22
A method for the structured application of a laminatable intermediate layer to a substrate for a semiconductor module, the method comprising the steps of:
- applying an isolating layer indirectly or directly to the substrate over a large area so that at least one semiconductor component or contact element attached to the substrate is covered by the isolating layer,
- applying the intermediate layer by lamination over a large area to the substrate including the isolating layer so that the at least one semiconductor component or contact element is further covered by the intermediate layer,
- opening the intermediate layer after being applied to the substrate at locations on the substrate to provide cutouts in the intermediate layer to expose the isolating layer at the cutout locations, the cutouts in the intermediate layer being produced by means of a laser such that in the region of each cutout a segment of the intermediate layer is completely separated from the remainder of the intermediate layer and then removed;
- and
- removing the isolating layer at the cutout locations after the isolating layer is applied to the substrate to expose at least partially a surface of the at least one semiconductor component or contact element.
A method for the structured application of a laminatable intermediate layer to a substrate for a semiconductor module, the method comprising the steps of:
- coating the substrate on at least one side with a planar metallization;
- adhering at least one semiconductor component or contact element to the substrate side having the planar metallization;
- applying an isolating layer indirectly or directly to the substrate so that the at least one semiconductor component or contact element attached to the substrate is covered by the isolating layer,
- applying the intermediate layer by lamination over to the substrate including the isolating layer so that the at least one semiconductor component or contact element is further covered by the intermediate layer,
- opening the intermediate layer at locations on the substrate to provide cutouts in the intermediate layer to expose the isolating layer at the cutout locations, the cutouts in the intermediate layer being produced by means of a laser such that in the region of each cutout a segment of the intermediate layer is completely separated from the remainder of the intermediate layer and then removed;
- and
- removing the isolating layer at the cutout locations after the isolating layer is applied to the substrate to expose at least partially a surface of the at least one semiconductor component or contact element.
Dependencies are inferred from the claim text.