Method for producing an optoelectronic component

A method for producing an optoelectronic component, the method comprising the steps of:

• a) providing a substrate;
• b) applying a semiconductor layer sequence to the substrate;
• c) applying at least first and second current expansion layers to the semiconductor layer sequence, the first current expansion layer being a metal layer;
• d) applying and patterning a mask layer;
• e) patterning the second current expansion layer by means of an etching process during which sidewalls of the mask layer are undercut;
• f) patterning the first current expansion layer by means of an etching process during which the sidewalls of the mask layer are undercut at least to a lesser extent than during the patterning of the second current expansion layer;
• and
• g) removing the mask layer.