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US 7,742,312 B2Granted
Electronic device and method of fabrication of a same
AssigneeLite-On Technology Corporation
InventorTe-Wei Li
Life of this patent
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Abstract
An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB) for sending or receiving a wireless signal, wherein the substrate is placed between the patterned conductive layer and PCB. The patterned conductive layer may be electrically connected to the PCB through a hole in the substrate by a connecting piece. The substrate may be a housing of the electronic device.
Claims8
An electronic device, comprising:
- a housing;
- and
- a patterned conductive layer formed on an outer surface of the housing and electrically connected to a control circuit to send or receive wireless signals, wherein the housing is between the patterned conductive layer and the control circuit;
- wherein the patterned conductive layer is formed by physical vapor deposition or screen printing.
1 more element
Dependencies are inferred from the claim text.