Damage prevention interposer for electronic package and electronic interconnect structure

An assembly for reducing damage to a related electronic package during attachment to a related electronic interconnect structure, comprising:

• a heat sink and an electronic component;
• an interposer having a first side and an opposing second side and having multiple holes formed in the interposer extending from the first side to the second side, wherein the interposer is configured for placement between the electronic package and the electronic interconnect structure,
• wherein locus of a wall of each of the holes is configured with a matching coupling component configured for electrically coupling the electronic package to the electronic interconnect structure,
• wherein the wall of each hole is configured to provide complete encirclement of that hole, and wherein the interposer mechanically inhibits physical contact between the electronic package and the electronic interconnect structure;
• where the electronic component is mounted between the heat sink and the interposer and the heat sink is attached to the interposer.