# US 7,742,309 B2 · Electronic device and method of assembling an electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,742,309 B2 - Document ID: US7742309B2 - Status: Granted - Kind: B2 - Application number: 11/647,613 - Filed: 2006-12-29 - Published: 2008-07-03 - Granted: 2010-06-22 - Earliest claimed: 2006-12-29 - Assignees: Nokia Corporation - Inventors: Jussi Hakunti; Pekka Kilpi; Anssi Vänskä; Teppo Aapro; Harri Lasarov - Web page: https://patentgrep.com/patent/US7742309B2 ## CPC - H05K 5/065: {sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding} - H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)} - H05K 5/062: {sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ} - H05K 9/0026: {integrally formed from metal sheet} - H05K 2201/0209: Inorganic, non-metallic particles - H05K 2201/10371: Shields or metal cases - H05K 2203/1316: Moulded encapsulation of mounted components - H05K 2203/1322: Encapsulation comprising more than one layer - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract An electronic device and method of assembling an electronic device, said device including an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the component and the overlaying protective layer. ## Claims ### Claim 1 A device comprising: an electronic component; an electrically insulating protective layer overlaying and in contact with at least a portion of the electronic component; and injection molded material overlaying at least the portion of the electronic component and the overlaying protective layer wherein the electrically insulating protective layer is arranged to protect the electronic component during injection molding of the overlaying injection molded material. ### Claim 2 (depends on 1) The device as claimed in claim 1 wherein the electrically insulating protective layer is also thermally conductive. ### Claim 3 (depends on 1) The device as claimed in claim 1 wherein the electrically insulating protective layer comprises a ceramic resin. ### Claim 4 (depends on 1) The device as claimed in claim 1 wherein the electrically insulating protective layer is housed within a protective shield. ### Claim 5 (depends on 1) The device as claimed in claim 1 wherein the electronic component is mounted on a substrate. ### Claim 6 (depends on 5) The device as claimed in claim 5 wherein the substrate acts as a heat sink during injection molding. ### Claim 7 (depends on 5) The device as claimed in claim 5 wherein the substrate forms part of the mechanical structure of the device. ### Claim 8 A method comprising: forming an electrically insulating protective layer over at least a portion of an electronic component, wherein the electronic component is mounted on a first side of a printed circuit board, and wherein the electrically insulating protective layer overlays and is in contact with at least the portion of the electronic component and at least a portion of the first side of the printed circuit board; and forming a molded layer over at least the portion of the electronic component and the overlaying protective layer by injection molding, wherein the molded layer is in contact with another different side of the printed circuit board. ### Claim 9 (depends on 8) The method as claimed in claim 8 wherein the electrically insulating protective layer protects the electronic component during injection molding. ### Claim 10 (depends on 8) The method as claimed in claim 8 wherein the electrically insulating protective layer is also thermally conductive. ### Claim 11 (depends on 8) The method as claimed in claim 8 wherein the electrically insulating protective layer comprises a ceramic resin. ### Claim 12 (depends on 8) The method as claimed in claim 8 wherein forming the electrically insulating protective layer comprises at least partially covering the electronic component in a viscous ceramic resin and then curing the resin. ### Claim 13 (depends on 12) The method as claimed in claim 12 wherein forming the electrically insulating protective layer comprises surrounding at least a portion of the electronic component with a frame and injecting the viscous ceramic resin into the frame. ### Claim 14 (depends on 8) The method as claimed in claim 8 comprising mounting the electronic component on a substrate before injection molding. ### Claim 15 (depends on 14) The method as claimed in claim 14 wherein the substrate acts as a heat sink during injection molding. ### Claim 16 (depends on 14) The method as claimed in claim 14 wherein the substrate forms part of the mechanical structure of the electronic device. ### Claim 17 (depends on 14) The method as claimed in claim 14 wherein the substrate is an aluminium I beam. ### Claim 18 A method comprising: mounting an electromagnetic shield to a printed circuit board; forming an electrically insulating protective layer between the electromagnetic shield and the printed circuit board, wherein the electrically insulating protective layer is in contact with the printed circuit board and the electromagnetic shield; attaching the printed circuit board to a substrate; injection molding over the printed circuit board; wherein the substrate forms part of an electronic device. ### Claim 19 (depends on 18) The method as claimed in claim 18 wherein the substrate provides mechanical support to the printed circuit board during injection molding. ### Claim 20 (depends on 18) The method as claimed in claim 18 wherein the substrate acts a heat sink during injection molding.