High performance power device
AssigneeRaytheon Company
InventorsJoseph R. Ellsworth, Michael P. Martinez, Stephen J. Pereira
Life of this patent
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AssigneeRaytheon Company
InventorsJoseph R. Ellsworth, Michael P. Martinez, Stephen J. Pereira
Estimating the term…
A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane. Optionally, a conductive via can be formed in portions of the signal carrying layer not occupied by the insert of PG, where the conductive via operably couples a first side of the signal carrying layer to a second side of the signal carrying layer.
A circuit card assembly, comprising:
A printed circuit board (PCB) assembly adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device, the printed circuit board assembly comprising:
A method of dissipating heat generated in a printed circuit board (PCB), the method comprising the unordered steps of:
Dependencies are inferred from the claim text.