Piezo fans for cooling an electronic device
AssigneeIntel Corporation
InventorsIoan Sauciuc, Sandeep Ahuja, Ashish Gupta
Life of this patent
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Abstract
A cooling system including one or more piezo fans for an electronic assembly is disclosed. The electronic assembly may include heat-generating components coupled with a front side of a printed circuit board (PCB) and one or more piezo fans coupled with a back side of the PCB. One or more piezo fans may be capable of cooling the heat-generating components from the back side. The cooling system may further include a heat sink coupled with the back side of the PCB.
Claims19
A cooling system for an electronic device, the cooling system comprising:
- one or more piezo fans coupled to a first side of a printed circuit board (PCB) capable of carrying one or more heated components coupled to a second side of the PCB;
- and
- one or more attachment mechanisms coupling said one or more piezo fans to the first side of the PCB;
- wherein said one or more piezo fans are capable of increasing airflow to the first side of the PCB and cooling said one or more heated components.
A cooling method for a computer assembly, the method comprising:
- coupling one or more piezo fans to a first side of a printed circuit board (PCB);
- and
- positioning said one or more piezo fans capable of increasing airflow to the first side of the PCB;
- wherein said one or more piezo fans comprises a blade coupled to a piezo element and capable of flexing in response to deformation of the piezo element;
- and
- wherein one or more heated components are coupled to a second side of the PCB.
An electronic assembly comprising:
- a printed circuit board (PCB) comprising a first side and a second side;
- a die or a socket coupled with the first side of the PCB;
- and
- one or more piezo fans coupled with an attachment mechanism capable of positioning said one or more piezo fans on the second side of the PCB.
Dependencies are inferred from the claim text.