Passively cooled computer
AssigneeDigital-Logic AG
InventorFelix Kunz
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Abstract
A passively cooled computer includes two or more components arranged in a housing frame 41, wherein each of these components is associated with a cooling body for dissipating waste heat of the component when the component is in operation. The cooling bodies each include a cooling surface, and these cooling surfaces are arranged to oppose one another with their cooling surfaces and thereby define an air channel leading vertically through the inside of the housing frame. The cooling bodies substantially separate the air channel from the remaining volume inside the housing frame.
Claims15
A passively cooled computer, comprising:
- at least two components arranged in a housing frame,
- wherein each of these components is associated with a cooling body for dissipating waste heat of the component when the component is in operation, and
- wherein the cooling bodies each comprise a cooling surface, and these cooling surfaces are arranged to face one another and thereby define an air channel leading vertically through the housing frame,
- wherein the cooling bodies comprise cooling ribs extending out of the cooling surfaces,
- wherein the cooling ribs are arranged to face one another, forming vertical channels, and
- wherein an insulation layer is arranged between the cooling ribs of at least one pair of cooling bodies that face one another.
A passively cooled computer, comprising:
- at least two or more components arranged in a housing frame,
- wherein each of these components is associated with a cooling body for dissipating waste heat of the component when the component is in operation,
- wherein the cooling bodies each comprise a cooling surface, and these cooling surfaces are arranged to face one another and thereby define an air channel leading vertically through the housing frame,
- wherein one of the at least two components is a mass storage device that is thermally coupled to one of the cooling bodies, and
- wherein the cooling body to which the mass storage device is thermally coupled is mounted by means of flexible elements to the other cooling body.
A passively cooled computer, comprising:
- at least two components arranged in a housing frame,
- wherein each of these components is associated with a cooling body for dissipating waste heat of the component when the component is in operation,
- wherein the cooling bodies each comprise a cooling surface, and these cooling surfaces are arranged to face one another and thereby define an air channel leading vertically through the housing frame,
- wherein the cooling bodies substantially separate the air channel from a remaining volume inside within the housing frame,
- wherein one of the at least two components is a processor unit that is thermally coupled to one of the cooling bodies, and
- wherein the passively cooled computer further comprises a power supply unit that is thermally coupled to a separate cooling body from the cooling body to which the processor unit is thermally coupled.
A passively cooled computer, comprising:
- at least two components arranged in a housing frame,
- wherein each of these components is associated with a cooling body for dissipating waste heat of the component when the component is in operation, and
- wherein the cooling bodies each comprise a cooling surface, and these cooling surfaces are arranged to face one another and thereby define an air channel leading vertically through the housing frame,
- wherein the cooling bodies substantially separate the air channel from a remaining volume within the housing frame,
- wherein the housing frame comprises a floor with an opening corresponding to an air intake opening of the air channel and the floor is distanced, by means of foot elements, from a surface on which the computer is placed, and
- wherein the computer further comprises metal housing cladding elements arranged outside of the housing frame, said cladding elements covering at least one side surface of the housing frame and being distanced from the housing frame by an air gap.
A passively cooled computer, comprising:
- at least two components arranged in a housing frame,
- wherein each of these components is associated with a cooling body for dissipating waste heat of the component when the component is in operation, and
- wherein the cooling bodies each comprise a cooling surface, and these cooling surfaces are arranged to face one another and thereby define an air channel leading vertically through the housing frame,
- wherein one of the at least two components is a mass storage device that is thermally coupled to one of the cooling bodies,
- wherein the mass storage device is rigidly attached to the cooling body to which it is thermally coupled, and
- wherein the cooling body to which the mass storage device is thermally coupled is mounted by means of flexible elements to the other cooling body.
Dependencies are inferred from the claim text.