Wiring structure of laminated capacitors

A laminated capacitor embedded in a circuit board, comprising:

• a number of conductive layers including a top conductive layer and a bottom conductive layer, the conductive layers including a set of first conductive layers and a set of second conductive layers;
• a power via extending along a thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, the power via being electrically coupled to the first conductive layers;
• a ground via extending along the thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, the ground via being electrically coupled to the second conductive layers;
• a supplemental via between the power via and the ground via, the supplemental via being shorter in length than the power via and the ground via, wherein the supplemental via is electrically coupled to one of the first conductive layers and the second conductive layers;
• and
• a number of dielectric layers, each dielectric layer being sandwiched between two neighboring conductive layers.

An integrated circuit substrate to which an integrated circuit chip is electrically coupled, comprising:

• a wiring board comprising a power plane and a ground plane;
• and
• a laminated capacitor being electrically coupled to the power plane and ground plane, and
• wherein the laminated capacitor comprises:
• a number of conductive layers including a top conductor layer and a bottom conductive layer, the conductive layers including a set of first conductive layers and a set of second conductive layers;
• a power via extending along a thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, the power via being electrically coupled to the first conductive layers;
• a ground via extending along the thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, the ground via being electrically coupled to the second conductive layers;
• a supplemental via between the power via and the ground via, the supplemental via being shorter in length than the power via and the ground via, wherein the supplemental via is electrically coupled to one of the first conductive layers and the second conductive layers;
• and
• a number of dielectric layers, each dielectric layer being sandwiched between two neighboring conductive layers.