Miniature quadrature hybrid

An integrated circuit comprising:

• a substrate having a semiconducting surface;
• a plurality of circuit elements formed on the semiconducting surface;
• and
• a multilayer metal interconnect structure for connecting said circuit elements, said interconnect structure having:
• a first conductive element in a first metal layer of said interconnect structure, said first conductive element having a first end and a second end;
• a second conductive element in said first metal layer, said second conductive element having a first end and a second end, and at least a portion of said first and said second conductive elements are adjacent along a path;
• a first series of conductive coupling elements disposed along said path in a second metal layer of said interconnect structure, said second metal layer selected to position said first series of coupling elements a pre-determined distance from said first and said second conductive line elements to increase a capacitive coupling between said first and said second conductive elements.