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US 7,741,756 B2Granted
Ultrasound transducer and method for implementing flip-chip two dimensional array technology to curved arrays
AssigneeKoninklijke Philips Electronics N.V.
InventorWojtek Sudol
Life of this patent
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Abstract
An ultrasound transducer probe (40) includes a support substrate (54), an integrated circuit (42) and an array of piezoelectric elements (50). The support substrate (54) has a non-linear surface (55). The integrated circuit (42) physically couples to the support substrate (54) overlying the non-linear surface (55), wherein the integrated circuit (42) substantially conforms to a shape of the non-linear surface (55). An array of piezoelectric elements (50) couples to the integrated circuit (42).
Claims19
An ultrasound transducer probe, comprising:
- a support substrate having a convex shaped non-linear surface;
- an integrated circuit physically coupled to the support substrate overlying the convex shaped non-linear surface, wherein said integrated circuit substantially conforms to a convex shape of the convex shaped non-linear surface;
- and
- an array of piezoelectric elements coupled to said integrated circuit.
1 more element
An ultrasound transducer probe, comprising:
- a support substrate having a convex shaped non-linear surface;
- an integrated circuit physically coupled to said support substrate overlying the convex shaped non-linear surface, wherein said integrated circuit substantially conforms to a convex shape of the convex shaped non-linear surface, and wherein said integrated circuit includes an active region and a passivation layer overlying the active region, wherein a thickness of said integrated circuit and a thickness of the passivation layer are selected to assure that neutral fibers of a bend structure coincide with the active region of said integrated circuit, wherein the bend structure includes that of said integrated circuit and the passivation layer;
- and
- an array of piezoelectric elements coupled to said integrated circuit via flip-chip conductive bump connections.
1 more element
Dependencies are inferred from the claim text.