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US 7,741,726 B2Granted
Integrated circuit underfill package system
AssigneeSTATS ChipPAC, Ltd.
InventorsHyung Jun Jeon, Ki Youn Jang, Dae-Wook Yang
Life of this patent
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Abstract
An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
Claims9
An integrated circuit underfill package system comprising:
- a substrate having a dispense port;
- a first integrated circuit die on the substrate;
- an underfill to the dispense port and between the substrate and the first integrated circuit die, the underfill covers portions of a side of the first integrated circuit die and leaves a surface of the first integrated circuit die uncovered;
- and
- a second integrated circuit die over the first integrated circuit die, and the underfill does not fill a space directly under the second integrated circuit die and the first integrated circuit die.
2 more elements
Dependencies are inferred from the claim text.