Semiconductor device

A semiconductor device comprising:

• a semiconductor substrate;
• a wiring layer disposed on the semiconductor substrate;
• an interlayer insulation film and a conductive layer that are disposed on the wiring layer so that the conductive layer is electrically connected to the wiring layer and forms a honeycomb structure with respect to a plane parallel to a primary plane of the semiconductor substrate and so that the interlayer insulation film fills hexagonal columns of the honeycomb structure;
• and
• an uppermost wiring layer disposed on the interlayer insulation film and the conductive layer so as to be electrically connected to the wiring layer through the conductive layer,
• wherein, in the plane parallel to the primary plane of the semiconductor substrate, a distance between a pair of opposing side surfaces of the hexagonal column of the honeycomb structure is equal to or larger than three times of a width of the conductive layer.