Semiconductor device comprising chip on chip structure

A semiconductor device comprising:

• a first chip and a second chip electrically connected to each other and disposed to face each other,
• wherein the first chip when pasted on the second chip has a first projection part which is part of an outer periphery of the first chip projecting from an outer periphery of the second chip,
• the first projection part has a first external terminal electrically connected to an exterior of the semiconductor device,
• wherein another first external terminal is formed on the surface facing said second chip and is connected to said second chip via a conductive connection wherein,
• wherein said second chip includes an internal joint terminal formed on the surface facing said first chip and connected to said conductive connection member, an external joint terminal formed on a surface opposite to the surface facing said first chip, and a first through hole electrically connecting said internal joint terminal and said external joint terminal, and
• wherein said first external terminal is connected to an outside of the semiconductor device via said external joint terminal.

A semiconductor device comprising:

• a first chip having a first element formed area and a first external terminal;
• a wiring layer disposed on said first chip;
• and
• a second chip disposed on said wiring layer, being smaller than said first chip, and having a second element formed area and at least one second external terminal,
• wherein said wiring layer comprises:
• an interconnection part electrically connecting the first and second element formed areas of said first and second chips;
• and
• an external connection part connected to said second external terminal;
• and
• a projection part projecting outward from an outer periphery of said second chip,
• wherein said external connection part includes said first external terminal which is formed on the surface facing said second chip and is connected to said second chip via a conductive connection member,
• wherein said second chip includes an internal joint terminal formed on the surface facing said first chip and connected to said conductive connection member, said internal joint terminal electrically connected to said second external terminal formed on a surface opposite to the surface facing said first chip via a first through hole, and
• wherein said first external terminal is connected to an outside of the semiconductor device via said external joint terminal.