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US 7,741,720 B2Granted
Electronic device with wire bonds adhered between integrated circuits dies and printed circuit boards
AssigneeSilverbrook Research Pty Ltd
InventorsKia Silverbrook, Laval Chung-Long-Shan, Kiangkai Tankongchumruskul
Life of this patent
Estimating the term…
Abstract
An electronic device that has an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors corresponding to each of the contact pads respectively, wire bonds electrically connecting each of the contact pads to the corresponding conductors and, an adhesive surface positioned between the contacts pads and the corresponding conductors. The wire bonds are secured to the adhesive surface to hold them in a low profile configuration.
Claims15
An electronic device comprising:
- a supporting structure;
- an integrated circuit die with a plurality of contacts pads;
- a printed circuit board with a plurality of conductors corresponding to each of the contact pads respectively, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other;
- wire bonds electrically connecting each of the contact pads to the corresponding conductors;
- and,
- an adhesive surface positioned between the contacts pads and the corresponding conductors;
- wherein,
- the wire bonds are secured to the adhesive surface and the adhesive surface is provided by a portion of the die attach film.
5 more elements
Dependencies are inferred from the claim text.