Semiconductor device, circuit substrate, electro-optic device and electronic appliance
AssigneeSeiko Epson Corporation
InventorsShuichi Tanaka, Haruki Ito, Yasuhito Aruga, Ryohei Tamura, Michiyoshi Takano
Life of this patent
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Abstract
A semiconductor device in the first embodiment includes: an electrode pad and a resin projection, formed on an active surface; a conductive film deposited from a surface of the electrode pad to a surface of the resin projection; a resin bump formed with the resin projection and with the conductive film. The semiconductor device is conductively connected to the opposing substrate through the resin bump electrode. The testing electrode is formed with the conductive film that is extended and applied to the opposite side of the electrode pad across the resin projection.
Claims18
A semiconductor device comprising:
- a resin projection disposed on an active surface of the semiconductor device;
- a line of linearly spaced apart electrode pads disposed on the active surface on a first side of the resin projection;
- and
- a plurality of linearly spaced apart conductive films extending over the resin projection, the conductive films each having:
- a first portion extending into a region on the first side of the resin projection that is connected to one of the electrode pads;
- and
- a second portion extending into a region on a second side of the resin projection opposite the first side, the second portions forming a line of first testing electrodes along the resin projection in the region on the second side of the resin projection;
- and
- a third portion extending from the second portion further into the region on the second side of the resin projection, the third portions forming an array of second testing electrodes conductively connected to the first testing electrodes.
A semiconductor device comprising:
- a resin projection disposed on an active surface;
- a resin layer formed on the active surface, the resin projection extending further away from the active surface than the resin layer;
- a line of linearly spaced apart electrode pads disposed on the active surface on a first side of the resin projection;
- and
- a plurality of linearly spaced apart conductive films extending over the resin projection, the conductive films each having:
- a first portion extending into a region on the first side of the resin projection that is connected to one of the electrode pads;
- and
- a second portion extending into a region on a second side of the resin projection opposite the first side, the second portions forming a line of first testing electrodes along the resin projection in the region on the second side of the resin projection;
- and
- a third portion extending from the second portion further into the region on the second side of the resin projection, the third portions forming an array of second testing electrodes conductively connected to the first testing electrodes.
Dependencies are inferred from the claim text.