Electronic device and lead frame

An apparatus for mounting a plurality of dies, each die having an anode, the apparatus comprising:

• a plurality of leads;
• a plurality of structures, each structure integral with at least one lead, the structures and the leads forming a lead frame;
• a plurality of receiving surfaces, at least one receiving surface associated with and formed on each structure, each receiving surface arranged to receive a die in such a manner that when the die is disposed on the receiving surface the anode does not meet the receiving surface;
• a plurality of fingers, each finger having a first end and a second end, the first end of each finger integral with the lead frame, and having at least a first bendable portion and a second bendable portion, the first bendable portion and the second bendable portion being separated from one another by at least one substantially straight non-bendable integral segment, the first bendable portion located where the first end of the finger is integral with the lead frame;
• and
• at least one electrode contact surface attached to the second end of each finger, each electrode contact surface bendably positionable with respect to one associated receiving surface via bending of the finger at the first bendable portion at the first end integral with the lead frame, and via the second bendable portion, wherein
• in an unbent position, each electrode contact surface not superposed over the associated receiving surface, to facilitate disposing the die on the associated receiving surface, and
• in a bent position, when the die is disposed on the associated receiving surface, each electrode contact surface superposed over the associated receiving surface to facilitate electrical connection between the anode of the die and one of the plurality of leads.