Back to results
US 7,741,652 B2Granted
Alignment device and application thereof
AssigneeVisEra Technologies Company Limited
InventorHsiao-Wen Lee
Life of this patent
Estimating the term…
Abstract
An alignment device and applications thereof are disclosed. The device comprises a dam structure disposed on a first substrate, and a post disposed on a second substrate at a position corresponding to the dam structure. The dam structure comprises a groove. The post is disposed in the groove of the dam structure when bonding the first and second substrates.
Claims23
An alignment device, comprising:
- a dam structure, comprising a groove, disposed on a first substrate;
- and
- a post disposed on a second substrate having a plurality of lenses at a position corresponding to the dam structure, wherein the post is disposed in the groove of the dam structure when bonding the first and second substrates.
A lens module, comprising:
- a lens substrate comprising a plurality of lenses on a lens surface thereof;
- a spacer substrate comprising a bonding surface bonding to the lens surface of the lens substrate, and the spacer substrate comprising a plurality of through holes respectively exposing the lenses;
- and
- an alignment device comprising a dam structure and a post, wherein
- the dam structure comprises a groove and one of the dam structures and the post is disposed on the lens surface of the lens substrate, the other is disposed on the bonding surface of the spacer substrate and the post is disposed in the groove of the dam structure.
2 more elements
A semiconductor device, comprising:
- a semiconductor wafer comprising a plurality chips on an active surface thereof;
- a lens substrate comprising a bonding surface bonding to the active surface of the semiconductor wafer, and the lens substrate comprising a plurality of lenses respectively over the chips;
- and
- an alignment device comprising a dam structure and a post, wherein the dam structure comprises a groove and one of the dam structures and the post is disposed on the active surface of the semiconductor substrate, the other is disposed on the bonding surface of the lens substrate, and the post is disposed in the groove of the dam structure.
1 more element
Dependencies are inferred from the claim text.