EUV light source, EUV exposure equipment, and semiconductor device manufacturing method
AssigneeNikon Corporation
InventorKatsuhiko Murakami
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AssigneeNikon Corporation
InventorKatsuhiko Murakami
Estimating the term…
A liquid in which fine solid Sn particles are dispersed in a resin is accommodated inside the heated tank 4. The resin pressurized by a pressurizing pump is conducted to a nozzle 1, so that a liquid-form resin is caused to jet from the tip end of the nozzle 1 that is disposed inside a vacuum chamber 7. The liquid-form resin which is caused to jet from the nozzle 1 assumes a spherical shape as a result of surface tension, and is solidified by being cooled in a vacuum, so that a solid-form target 2 is formed. A laser introduction window 10 used for the introduction of laser light is formed in the vacuum chamber 7, and laser light generated from a laser light source 8 disposed on the outside of the vacuum chamber 7 is focused by a lens 9 and conducted into the vacuum chamber 7, so that the target is converted into a plasma, thus generating EUV light.
A plasma EUV light source comprising:
An EUV exposure apparatus comprising:
A semiconductor device manufacturing method comprising the steps of:
Dependencies are inferred from the claim text.