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US 7,741,603 B2Granted
Microcantilever infrared sensor array
AssigneeAgiltron, Inc.
InventorsGregory Simelgor, Scott R. Hunter
Life of this patent
Estimating the term…
Abstract
A radiation sensor array that exhibits improved fill factor is disclosed. The radiation sensor array incorporates sensors having support arms that are nested in vertical fashion with the support arms of neighboring sensors. This vertically-nested structure enables the radiation-sensing portions of the sensors to be more closely-packed.
Claims15
An apparatus comprising:
- (1) a substrate having a first substrate electrode and a second substrate electrode;
- (2) a first sensor, wherein said first sensor comprises;
- (a) a first plate for converting incident radiation into heat, wherein said first plate is physically adapted to conduct electricity and to conduct heat;
- and
- (b) a first support arm for supporting said first plate above said first substrate electrode, wherein said first support arm comprises a first actuator for controlling the height at which said first plate is supported above said first substrate electrode;
- and
- (3) a second sensor, wherein said second sensor comprises;
- (a) a second plate for converting incident radiation into heat, wherein said second plate is physically adapted to conduct electricity and to conduct heat;
- and
- (b) a second support arm for supporting said second plate above said second substrate electrode, wherein said second support arm comprises a second actuator for controlling the height at which said second plate is supported above said second substrate electrode;
- wherein at least a portion of said second support arm overlaps at least a portion of said first support arm.
8 more elements
An apparatus comprising:
- (1) a substrate;
- (2) a first sensor disposed on said substrate, wherein said first sensor comprises;
- (a) a first plate for converting incident radiation into heat, wherein said first plate is physically adapted to conduct electricity and to conduct heat;
- and
- (b) a first support arm for supporting said first plate above said substrate, wherein said first support arm comprises a first thermal bimorph having a first length and a first shape and a second thermal bimorph having a second length and a second shape, and wherein said first length and said second length are substantially equal, and further wherein said first shape and said second shape are substantially identical;
- and
- (3) a second sensor disposed on said substrate, wherein said second sensor comprises;
- (a) a second plate for converting incident radiation into heat, wherein said second plate is physically adapted to conduct electricity and to conduct heat;
- and
- (b) a second support arm for supporting said second plate above said substrate, wherein said second support arm comprises a third thermal bimorph having a third length and a third shape and a fourth thermal bimorph having a fourth length and a fourth shape, and wherein said third length and said fourth length are substantially equal, and further wherein said third shape and said fourth shape are substantially identical;
- wherein at least a portion of said second support arm overlaps said substrate and at least a portion of said first sensor.
8 more elements
An apparatus comprising:
- a first sensor disposed on a substrate, wherein said first sensor comprises:
- a first plate for converting incident radiation into heat, wherein said first plate is physically adapted to conduct electricity and to conduct heat;
- and
- a first support arm for supporting said first plate above said substrate, wherein said first support arm comprises a first thermal bimorph having a first shape and a first responsivity and a second thermal bimorph having a second shape and a second responsivity, and wherein said first shape and said second shape are substantially identical, and further wherein said first responsivity and said second responsivity are substantially equal;
- a second sensor disposed on said substrate, wherein said second sensor comprising:
- a second plate for converting incident radiation into heat, wherein said second plate is physically adapted to conduct electricity and to conduct heat;
- and
- a second support arm for supporting said second plate above said substrate, wherein said second support arm comprises a third thermal bimorph having a third responsivity and a fourth thermal bimorph having a fourth responsivity, and wherein said third responsivity and said fourth responsivity are substantially equal;
- wherein at least a portion of said second support arm overlaps at least a portion of said first sensor and said substrate.
6 more elements
Dependencies are inferred from the claim text.