US 7,741,566 B2 · Microelectronic substrates with thermally conductive pathways and methods of making same

Abstract

This disclosure suggests microelectronic substrates with thermally conductive pathways. In one implementation, such a substrate includes a body and a thermally conductive member. The Body has a first surface that includes a microelectronic component mounting site, a second surface separated from the first surface by a thickness, and an opening extending through at least a portion of the thickness. The opening is outwardly open at one or both of the surfaces and has a first portion having a first transverse dimension and a second portion having a larger second transverse dimension. The thermally conductive member includes a first thickness, which is received in the first portion of the opening, and a second thickness, which is received in the second portion of the opening. A transverse dimension of the second thickness of the thermally conductive member is greater than the first transverse dimension of the opening.

Claims4

Dependent claims

A multi-layer printed circuit board comprising:

a first body layer having a first opening therethrough;
a second body layer juxtaposed with the first body layer and having a second opening therethrough, the second opening extending outwardly beyond a periphery of the first opening to define an attachment surface on the first body layer;
an electrically conductive layer disposed between the first and second body layers;
a thermally conductive slug received in and extending between the first and second openings and thermally coupled to the electrically conductive layer, the slug including a transversely extending flange that is attached to the attachment surface;
and
a third body layer juxtaposed with the second body layer and spaced from the first body layer, the third body layer having a third opening therethrough that is smaller than the second opening, wherein the flange of the slug is received between the first and third body layers.

3 more elements

Dependencies are inferred from the claim text.

Microelectronic substrates with thermally conductive pathways and methods of making same

Life of this patent

Microelectronic substrates with thermally conductive pathways and methods of making same

Life of this patent

Abstract

Claims4