# US 7,741,565 B2 · Electronic component and method for manufacturing the same

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- Number: US 7,741,565 B2
- Document ID: US7741565B2
- Status: Granted
- Kind: B2
- Application number: 11/947,219
- Filed: 2007-11-29
- Published: 2008-10-09
- Granted: 2010-06-22
- Earliest claimed: 2007-04-06
- Assignees: Panasonic Corporation
- Inventors: Nobuya Matsutani; Michio Ohba; Toshiyuki Atsumi; Hitoshi Ishimoto
- Web page: https://patentgrep.com/patent/US7741565B2

## CPC

- H01C 7/005: {Polymer thick films}
- H01C 17/006: {adapted for manufacturing resistor chips}
- H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)}
- H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)}
- H01F 27/027: {specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards}
- H01F 27/266: {Fastening or mounting the core on casing or support (on coil H01F27/30)}
- H01F 27/34: Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01C: RESISTORS
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES

## Abstract

In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities 17 are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps 16 or irregularities 17 allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.

## Claims

### Claim 1

An electronic component comprising:
an external electrode;
a resin section that is made of resin and contacts with the external electrode; and
an internal electrode covered with the resin section, wherein
a bump, which is made of the resin, has a height ranging from 1 μm to 10 μm inclusive and has a thickness ranging from 5 μm to 50 μm inclusive, is formed on one surface or two-or-more surfaces of at least the resin section.

### Claim 2

An electronic component comprising:
an external electrode;
a resin section that is made of resin and contacts with the external electrode; and
an internal electrode covered with the resin section, wherein,
irregularities made of the resin and with a height ranging from 1 μm to 10 μm inclusive are formed on one surface or two-or-more surfaces of at least the resin section.

### Claim 3 (depends on 1, 2)

The electronic component of claim 1 or claim 2, wherein the internal electrode is made of copper and is formed into a coil pattern.

### Claim 4 (depends on 1)

The electronic component of claim 1, wherein:
the resin section has four surfaces,
the bump is formed on two surfaces of the resin section, and
other two surfaces of the resin section are flat without the bump.

### Claim 5 (depends on 4)

The electronic component of claim 4, wherein:
the two surfaces on which the bump is formed are opposite each other, and
the two flat surfaces are opposite each other.

### Claim 6 (depends on 1)

The electronic component of claim 1, wherein the resin comprises photoresist.

### Claim 7 (depends on 2)

The electronic component of claim 2, wherein:
the resin section has four surfaces,
the irregularities are is formed on two surfaces of the resin section, and
other two surfaces of the resin section are flat without the irregularities.

### Claim 8 (depends on 7)

The electronic component of claim 7, wherein:
the two surfaces on which the irregularities are formed are opposite each other, and
the two flat surfaces are opposite each other.

### Claim 9 (depends on 2)

The electronic component of claim 2, wherein the resin comprises photoresist.

### Claim 10

A method for manufacturing an electronic component comprising:
forming a predetermined pattern made of photoresist on a substrate; and
forming an internal electrode on the substrate or on the photoresist-made pattern so as to have a predetermined pattern, wherein
a plurality of bumps with a height ranging from 1 μm to 10 μm inclusive are formed on one surface or two-or-more surfaces of resin section made of the photoresist while said forming steps are repeated a plurality number of times.