Epoxy resin composition and semiconductor device
AssigneeSumitomo Bakelite Co., Ltd.
InventorsKazuyoshi Murotani, Ken Ukawa
Life of this patent
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Abstract
The present invention is to provide an epoxy resin composition for encapsulating a semiconductor having a high flame resistance without using a flame retarder and having an excellent solder reflow resistance, and a semiconductor device using the same for encapsulating a semiconductor element. An epoxy resin composition for encapsulating a semiconductor of each of the first, second and third aspects essentially comprises (A) a phenol aralkyl type epoxy resin having a phenylene structure, (B) a phenol aralkyl type phenolic resin having a biphenylene structure and (D) an inorganic filler as common components, wherein (D) the inorganic filler is contained at the rate of 84 wt % or more and 92 wt % or less of the total amount of the epoxy resin composition.
Claims24
An epoxy resin composition for encapsulating a semiconductor essentially comprising (A) an epoxy resin represented by the following formula (1), (B) a phenolic resin represented by the following formula (2), (C) a curing accelerator, (D) an inorganic filler and (E) a triazole compound having a mercapto group, wherein (D) the inorganic filler is present in an amount of 84 wt % to 92 wt % based on the total amount of the epoxy resin composition;
- and wherein (E) the triazole compound is present in an amount of 0.01 to 2 wt % based on the total amount of the epoxy resin composition:
- Formula (1)
- wherein R is hydrogen or an alkyl group having 1 to 4 carbons, which may be the same or different from each other;
- “a” is an integer of 0 to 4;
- “b” is an integer of 0 to 4;
- “c” is an integer of 0 to 3;
- “d” is an integer of 0 to 4;
- and “n” is a mean value and 0 or a positive number of 10 or less;
- Formula (2)
- wherein R is hydrogen or an alkyl group having 1 to 4 carbons, which may be the same or different from each other;
- “a” is an integer of 0 to 4;
- “b” is an integer of 0 to 4;
- “c” is an integer of 0 to 3;
- “d” is an integer of 0 to 4;
- and “n” is a mean value and 0 or a positive number of 10 or less.
An epoxy resin composition for encapsulating a semiconductor essentially comprising (A) an epoxy resin represented by the following formula (1), (B) a phenolic resin represented by the following formula (2), (H) a curing accelerator represented by the following formula (5), (I) a silane coupling agent and (D) an inorganic filler which consists of a member selected from the group consisting of fused silica, crystalline silica, secondary aggregated silica, alumina, titanium white, glass fiber, and mixtures thereof, wherein (H) the curing accelerator represented by the formula (5) is present in an amount of 0.05 wt % to 0.5 wt % and (D) the inorganic filler is present in an amount of 84 wt % to 92 wt % based on the total amount of the epoxy resin composition:
- Formula (1)
- wherein R is hydrogen or an alkyl group having 1 to 4 carbons, which may be the same or different from each other;
- “a” is an integer of 0 to 4;
- “b” is an integer of 0 to 4;
- “c” is an integer of 0 to 3;
- “d” is an integer of 0 to 4;
- and “n” is a mean value and 0 or a positive number of 10 or less;
- Formula (2)
- wherein R is hydrogen or an alkyl group having 1 to 4 carbons, which may be the same or different from each other;
- “a” is an integer of 0 to 4;
- “b” is an integer of 0 to 4;
- “c” is an integer of 0 to 3;
- “d” is an integer of 0 to 4;
- and “n” is a mean value and 0 or a positive number of 10 or less;
- Formula (5)
- wherein P is a phosphorus atom;
- each of R1 to R4 is an organic group having 6 to 20 carbons containing an aromatic ring or an aliphatic hydrocarbon group having 1 to 20 carbons, which may be the same or different from each other;
- and “m” is a number of O≦m≦2.
An epoxy resin composition for encapsulating a semiconductor essentially comprising (A) an epoxy resin represented by the following formula (1), (B) a phenolic resin represented by the following formula (2), (E) a triazole compound having a mercapto group, (F) organopolysiloxane having a carboxyl group, (C) oxidized polyethylene and (D) one or more kinds of inorganic fillers selected from the group consisting of fused silica, crystalline silica, secondary aggregated silica, alumina, titanium white, and glass fiber, wherein (D) the inorganic filler is present in an amount of 84 wt % to 92 wt % based on the total amount of the epoxy resin composition;
- and wherein (E) the triazole compound is present in an amount of 0.01 to 2 wt % based on the total amount of the epoxy resin composition:
- Formula (1)
- wherein R is hydrogen or an alkyl group having 1 to 4 carbons, which may be the same or different from each other;
- “a” is an integer of 0 to 4;
- “b” is an integer of 0 to 4;
- “c” is an integer of 0 to 3;
- “d” is an integer of 0 to 4;
- and “n” is a mean value and 0 or a positive number of 10 or less;
- Formula (2)
- wherein R is hydrogen or an alkyl group having 1 to 4 carbons, which may be the same or different from each other;
- “a” is an integer of 0 to 4;
- “b” is an integer of 0 to 4;
- “c” is an integer of 0 to 3;
- “d” is an integer of 0 to 4;
- and “n” is a mean value and 0 or a positive number of 10 or less.
Dependencies are inferred from the claim text.