Conductive via formation utilizing electroplating
AssigneeFreescale Semiconductor, Inc.
InventorsTerry G. Sparks, Robert E. Jones
Life of this patent
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Abstract
A method for forming a conductive via is discussed and includes forming a seed layer over a first side of a semiconductor substrate, wherein the semiconductor substrate includes a first side opposite a second side, forming a via hole in a semiconductor substrate from the second side of the semiconductor substrate, wherein the via hole exposes the seed layer; and electroplating a conductive via material in the via hole from the seed layer. In one embodiment, a continuous conductive layer is formed over and electrically coupled to the seed layer. The continuous conductive layer can serve as the current source while electroplating the conductive via material.
Claims22
A method for forming a conductive via, the method comprising:
- forming a conductive layer over a first side of a semiconductor substrate, wherein the semiconductor substrate comprises a first side and a second side and the first side is opposite the second side;
- patterning the conductive layer to form a landing pad;
- forming a via hole in the semiconductor substrate from the second side of the semiconductor substrate, wherein the via hole exposes the landing pad;
- and
- electroplating a conductive via material in the via hole using the landing pad as a seed layer;
- forming a continuous conductive layer over the first side of the semiconductor substrate, wherein the landing pad is electrically coupled to the continuous conductive layer, and the continuous conductive layer serves as a current source for electroplating the conductive via material.
A method for forming a conductive via, the method comprising:
- forming a seed layer over a first side of a semiconductor substrate, wherein the semiconductor substrate comprises a first side and a second side and the first side is opposite the second side;
- forming a continuous conductive layer over the seed layer, wherein the seed layer is electrically coupled to the continuous conductive layer;
- after forming the seed layer, forming a via hole in the semiconductor substrate from the second side of the semiconductor substrate, wherein the via hole exposes the seed layer;
- and
- electroplating a conductive via material from the seed layer in the via hole using the continuous conductive layer as a current sources patterning the continuous conductive layer after electroplating the conductive via material.
A method for forming a conductive via, the method comprising:
- forming a seed layer over a first side of a semiconductor substrate, wherein the semiconductor substrate comprises a first side and a second side and the first side is opposite the second side;
- forming a continuous conductive layer over the seed layer, wherein the seed layer is electrically coupled to the continuous conductive layer;
- after forming the seed layer, forming a via hole in the semiconductor substrate from the second side of the semiconductor substrate, wherein the via hole exposes the seed layer;
- and
- electroplating a conductive via material from the seed layer in the via hole using the continuous conductive layer as a current source;
- wherein the forming the continuous conductive layer further comprises forming the continuous conductive layer, wherein the continuous conductive layer comprises aluminum.
A method for forming a conductive via, the method comprising:
- forming a conductive layer over a first side of a semiconductor substrate, wherein the semiconductor substrate comprises a first side and a second side, the first side is opposite the second side, and the semiconductor substrate comprises active circuitry;
- patterning the conductive layer to form a landing pad;
- forming a continuous conductive layer over the landing pad, wherein the continuous conductive layer is electrically coupled to the landing pad;
- etching the semiconductor substrate from the second side to form a via hole and expose the landing pad;
- electroplating a conductive via material in the via hole using the landing pad as a seed layer and the continuous conductive layer as a current source;
- and
- patterning the continuous conductive layer after electroplating the conductive via material.
Dependencies are inferred from the claim text.