US 7,741,155 B2 · Method of manufacturing semiconducting device with stacked dice

Abstract

Some embodiments of the present invention relate to a semiconducting device and method that include a substrate and a first die that is attached to the substrate. The first die includes active circuitry (e.g., a flash memory array or logic circuitry) on an upper surface of the first die. The semiconducting device further includes a spacer that covers the active circuitry on the upper surface of the first die and a second die that is stacked onto the spacer and the first die. The spacer extends from a first side of the first die to an opposing second side of the first die. The spacer also extends near a third side of the first die and an opposing fourth side of the first die such that the active circuitry is exposed near the third and fourth sides of the first die.

Claims9

Dependent claims

A method comprising:

securing a first die to a substrate, the first die including active circuitry on an upper surface;
covering the active circuitry on the upper surface of the first die with a spacer that extends from a first side of the first die to an opposing second side of the first die, the spacer extending near a third side of the first die and an opposing fourth side of the first die such that the active circuitry is exposed near the third and fourth sides of the first die;
and
stacking a second die onto the spacer and the first die, wherein covering the active circuitry on the first die with a spacer includes covering the active circuitry where at least one section of the spacer extends to the third side of the first die such that only a portion of the active circuitry is exposed near the third side of the first die.

1 more element

Dependencies are inferred from the claim text.

Method of manufacturing semiconducting device with stacked dice

Life of this patent

Method of manufacturing semiconducting device with stacked dice

Life of this patent

Abstract

Claims9