Back to results
US 7,741,154 B2Granted
Integrated circuit package system with stacking module
AssigneeSTATS ChipPAC, Ltd.
InventorsJong-Woo Ha, Flynn Carson, BumJoon Hong, SeongMin Lee
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system comprising: providing a module lead array; attaching a module integrated circuit adjacent the module lead array; attaching a module substrate over the module integrated circuit; and applying a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate are partially exposed.
Claims20
An integrated circuit package system comprising:
- providing a module lead array;
- attaching a module integrated circuit adjacent the module lead array;
- attaching a module substrate over the module integrated circuit;
- and
- applying a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate are partially exposed.
2 more elements
An integrated circuit package system comprising:
- forming a module lead array having a die attach region;
- mounting a module integrated circuit over the die attach region adjacent the module lead array;
- connecting module die connectors to the module integrated circuit and the module lead array;
- mounting a module substrate having module substrate conductors over the module integrated circuit on a side opposite the module lead array;
- connecting module substrate connectors to the module substrate and the module lead array;
- and
- forming a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate conductors are partially exposed.
4 more elements
An integrated circuit package system comprising:
- a module lead array;
- a module integrated circuit adjacent the module lead array;
- a module substrate over the module integrated circuit;
- and
- a module encapsulant over the module integrated circuit wherein the module lead array and the module substrate are partially exposed.
2 more elements
Dependencies are inferred from the claim text.