Method for forming a film by spin coating
AssigneeFUJIFILM Corporation
InventorsYukou Saito, Masashi Hakamata
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Abstract
It is an object of the present invention to provide a method for producing a solid substrate used for sensors having a film with a small film thickness distribution, and a solid surface used for sensors having a film with a small film thickness distribution. The present invention provides a method for producing a solid substrate for sensors that has a coating on the surface using spin coating, wherein a substrate to be coated is rotated in an atmosphere in which the vapor pressure of coating solvent is 50% to 100% with respect to the saturation vapor pressure so as to form a thin film of a coating solution on said substrate to be coated.
Claims5
A method for producing a solid substrate for sensors that has a coating on the surface using spin coating, wherein a substrate to be coated is rotated in an atmosphere in which the vapor pressure of coating solvent is 50% to 100% with respect to the saturation vapor pressure so as to form a thin film of a coating solution on said substrate to be coated;
- wherein said substrate to be coated is set on an inner cup at a position such that the distribution of the centrifugal force on said substrate to be coated, which is produced by the rotation of an inner cup, is such that the maximum centrifugal force on said substrate is 100 times or less the minimum centrifugal force on said substrate, the coating solution is added dropwise onto the surface of said substrate to be coated, and then said substrate to be coated is rotated.
Dependencies are inferred from the claim text.