Tools and methods for disuniting semiconductor wafers
AssigneeS.O.I.Tec Silicon on Insulator Technologies
InventorsSebastien Kerdiles, Yves-Matthieu Le Vaillant
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Abstract
A tool and method for disuniting two wafers, wherein at least one of the wafers is used in fabricating substrates for microelectronics, optoelectronics, or optics. The method includes the steps of temporarily affixing two gripper members to respective opposite faces of the wafers; and sufficiently displacing one of the gripper members relative to the other for inducing controlled flexing in at least one of the members and for exerting a force close to one edge of the wafers to assist in disuniting the wafers. If desired, the bonding energy between two wafers can be determined by measuring the force exerted during the displacement step or measuring the separation of the wafers while performing the disuniting operation.
Claims8
A method of disuniting two wafers, with at least one of the wafers being used in fabricating substrates for microelectronics, optoelectronics, or optics, the method comprising the following steps:
- temporarily affixing two gripper members to respective opposite faces of the wafers;
- and sufficiently displacing one of the gripper members relative to the other for inducing controlled flexing in at least one of the gripper members and for responsively exerting a force close to one edge of the wafers to assist in disuniting the wafers, wherein one or each gripper member comprises a body generally in the form of a plate having different degrees of elastic deformability in at least two locations.
Dependencies are inferred from the claim text.