Flux composition and techniques for use thereof
AssigneeInternational Business Machines Corporation
InventorsEric Duchesne, Michael Gaynes, Timothy A. Gosselin, Kang-Wook Lee, Valerie Oberson
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Abstract
The present invention is directed to soldering techniques and compositions for use therein. In one aspect, a flux composition is provided. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. In another aspect, a soldering method for joining objects is provided comprising the following steps. A flux composition and a solder compound are applied to at least a portion of one or more of the objects. The flux composition comprises a fluxing agent comprising organic acid, an organic tacking agent and an organic wetting agent. The objects are then joined.
Claims30
A flux composition, wherein the flux composition leaves a solid washable residue upon completion of a soldering process that can be cleaned with water, comprising:
- a fluxing agent comprising organic acid, wherein the flux composition comprises from about one percent by weight to about ten percent by weight of the fluxing agent, based on the total weight of the composition;
- an organic tacking agent, wherein said organic tacking agent increases the surface tension and viscosity of said flux composition, wherein said viscosity of said flux composition comprises a viscosity value in a range of from about 50 millipascal seconds to about 500 millipascal seconds and said surface tension of said flux composition comprises a surface tension value in a range of about 40 millinewtons per meter to about 200 millinewtons per meter, and wherein the flux composition comprises from about 50 percent by weight to about 99 percent by weight of the organic tacking agent, based on the total weight of the composition;
- an organic wetting agent;
- and
- water, wherein the water minimizes oxide formation and removes one or more oxides from a solder surface, and wherein the flux composition comprises from about one percent by weight to about five percent by weight water, based on the total weight of the composition.
A soldering method for joining objects, the method comprising the steps of:
- applying a flux composition, wherein the flux composition leaves a solid washable residue upon completion of a soldering process that can be cleaned with water, and a solder compound to at least a portion of one or more of the objects, the flux composition comprising:
- a fluxing agent comprising organic acid, wherein the flux composition comprises from about one percent by weight to about ten percent by weight of the fluxing agent, based on the total weight of the composition;
- an organic tacking agent, wherein said organic tacking agent increases the surface tension and viscosity of said flux composition, wherein said viscosity of said flux composition comprises a viscosity value in a range of from about 50 millipascal seconds to about 500 millipascal seconds and said surface tension of said flux composition comprises a surface tension value in a range of about 40 millinewtons per meter to about 200 millinewtons per meter, and wherein the flux composition comprises from about 50 percent by weight to about 99 percent by weight of the organic tacking agent, based on the total weight of the composition;
- an organic wetting agent;
- water, wherein the water minimizes oxide formation and removes one or more oxides from a solder surface, and wherein the flux composition comprises from about one percent by weight to about five percent by weight water, based on the total weight of the composition;
- joining the objects;
- and
- using water to remove one or more oxides from one or more of the joined objects.
A flux composition, wherein the flux composition leaves a solid washable residue upon completion of a soldering process that can be cleaned with water, comprising, based on the total weight of the composition:
- from about one percent by weight to about ten percent by weight fluxing agent;
- from about 50 percent by weight to about 99 percent by weight or organic tacking agent, wherein said organic tacking agent increases the surface tension and viscosity of said flux composition, wherein said viscosity of said flux composition comprises a viscosity value in a range of from about 50 millipascal seconds to about 500 millipascal seconds and said surface tension of said flux composition comprises a surface tension value in a range of about 40 millinewtons per meter to about 200 millinewtons per meter;
- from about one percent by weight to about 45 percent by weight organic wetting agent;
- and
- from about one percent by weight to about five percent by weight water, wherein the water minimizes oxide formation and removes one or more oxides from a solder surface.
Dependencies are inferred from the claim text.