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US 7,740,488 B2Granted
Interposer assembly and method
AssigneeAmphenol Corporation
InventorPaul R. Taylor
Life of this patent
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AssigneeAmphenol Corporation
InventorPaul R. Taylor
Estimating the term…
An interposer assembly for forming electrical connections between contact pads on opposed substrates includes a top plate, a bottom plate, a lateral shift interface between the plates and a plurality of electrical circuit paths extending between contact surfaces at the top of the top plate and at the bottom of the bottom plate. The circuit paths maintain electrical connections between opposed pairs of pads on the substrates despite misalignment of the substrates or lateral shifting of the plates at the interface because of forces exerted on the substrates. The plates are secured together to permit limited lateral movement at the interface. The assembly may have a circuit board plate between the top and bottom plates and two lateral shift interfaces. The contacts may have very small and high contact pressure shear-formed contact tips.
An interposer assembly for establishing electrical connections between pads on two opposed substrates, the assembly comprising first and second stacked plates to be positioned between the substrates;
The method of forming conductive paths between pads on opposed substrates comprising the steps of:
An interposer assembly for forming electrical connections between pads on upper and lower members, the assembly comprising a top insulating body, a bottom insulating body, a first lateral shift interface between the bodies, and a plurality of continuous electrical circuit paths, each path extending through the top body, across the lateral shift interface and through the bottom body, each path including a contact surface on the top body and a contact surface on the bottom body, wherein the contact surfaces on the top body make electrical connections with pads on an upper member and the contact surfaces on the bottom body make electrical connections with pads on a lower member independent of alignment of the members and the assembly maintains the continuous electrical circuit paths between the contact surfaces over a range of lateral shifting of the bodies at the interface.
The method of maintaining electrical connections between pads on opposed substrates comprising the steps of:
Dependencies are inferred from the claim text.