Method for forming surface graft, conductive film and metal patterns

A method for forming a conductive film, comprising the processes of:

• applying energy to the surface of a substrate containing polyimide represented by general formula (IV):
• wherein R1 represents a tetravalent organic group, R2 represents a divalent organic group, n represents an integer of 1 or more, and at least one of R1 and R2 is a group containing a structure having a polymerization initiating ability, wherein the structure having a polymerization initiating ability is selected from the group consisting of an aromatic ketone, an onium salt compound, an organic peroxide, a thio compound, a hexaaryl biimidazole compound, a ketoxime ester compound, a borate compound, an adinium compound, an active ester compound, a compound having a carbon halogen bond, and a pyridinium compound to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group;
• and
• causing a conductive material to adhere to the graft polymer.

A method for forming a conductive film, comprising the processes of:

• applying energy to the surface of a substrate containing polyimide represented by general formula (IV):
• wherein R1 represents a tetravalent organic group, R2 represents a divalent organic group, n represents an integer of 1 or more, and at least one of R1 and R2 is a group containing a structure having a polymerization initiating ability, wherein the structure having a polymerization initiating ability is selected from the group consisting of an aromatic ketone, an onium salt compound, an organic peroxide, a thio compound, a hexaaryl biimidazole compound, a ketoxime ester compound, a borate compound, an adinium compound, an active ester compound, a compound having a carbon halogen bond, and a pyridinium compound, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the polyimide substrate starting from the active points and that has a polar group;
• applying a metal ion or a metal salt to the graft polymer;
• and
• reducing the metal ion or a metal ion in the metal salt to deposit metal fine particles.

A method for forming a conductive film, comprising the processes of:

• applying energy to the surface of a substrate containing polyimide represented by general formula (IV):
• wherein R1 represents a tetravalent organic group, R2 represents a divalent organic group, n represents an integer of 1 or more, and at least one of R1 and R2 is a group containing a structure having a polymerization initiating ability, wherein the structure having a polymerization initiating ability is selected from the group consisting of an aromatic ketone, an onium salt compound, an organic peroxide, a thio compound, a hexaaryl biimidazole compound, a ketoxime ester compound, a borate compound, an adinium compound, an active ester compound, a compound having a carbon halogen bond, and a pyridinium compound, to generate active points on the surface of the substrate, and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a functional group interacting with an electroless plating catalyst or the precursor thereof;
• applying the electroless plating catalyst or the precursor thereof to the graft polymer;
• and
• carrying out electroless plating.