Loading patent…
AssigneeInternational Business Machines Corporation
InventorsRonald Xavier Arroyo, Kenneth A. Bird, William A. Ciarfella, Bret Peter Elison, Gary Franklin Goth, Terrance Wayne Kueper, Thoi Nguyen, Roger Donell Weekly
Estimating the term…
Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria are contemplated. Embodiments may include a tester to couple with the DUT to determine an operating junction temperature. In some embodiments, the measured junction temperature may be the operating junction temperature anticipated for the DUT in a customer installation. In other embodiments, the tester may comprise logic to calculate a projected, operating junction temperature based upon the measured junction temperature and known differences between the tester and a customer installation. Upon determining the operating junction temperature for the DUT at the customer installation, the operating junction temperature is compared against a maximum junction temperature for proper operation of the DUT. Advantageously, the maximum junction temperature may be varied based upon the project objective for a line of DUTs.
A system to assess the thermal performance of a component having a thermal assembly coupled with a die that comprises a thermal sensor, the system comprising:
A machine-accessible storage medium containing instructions, which when executed by a machine, cause the machine to perform operations to assess the thermal performance of a component having a thermal assembly coupled with a die that comprises a thermal sensor, the operations comprising:
A method to perform operations to assess the thermal performance of a component having a thermal assembly coupled with a die that comprises a thermal sensor, the method comprising:
Dependencies are inferred from the claim text.