Electronic component mounting structure
AssigneeDenso Corporation
InventorsAtsushi Ito, Takayoshi Honda, Hidehiro Mikura, Tadashi Tsuruzawa, Takuya Sakuta
Life of this patent
Estimating the term…
Loading patent…
AssigneeDenso Corporation
InventorsAtsushi Ito, Takayoshi Honda, Hidehiro Mikura, Tadashi Tsuruzawa, Takuya Sakuta
Estimating the term…
An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
An electronic component mounting structure comprising:
A circuit board on which an electronic component is mounted, the circuit board comprising:
Dependencies are inferred from the claim text.