Circuit board with embedded passive component and fabricating process thereof

A circuit board with an embedded passive component, comprising:

• a dielectric layer;
• an electrode-patterned layer, embedded in the dielectric layer and located at a surface of the dielectric layer, wherein the electrode-patterned layer has a plurality of electrodes, each of the electrodes has a top surface adjacent to and substantially parallel to the surface of the dielectric layer, a bottom surface opposite the top surface and connecting with the dielectric layer, and a side surface connecting the top surface and the bottom surface, and the side surface is substantially perpendicular to the surface of the dielectric layer;
• a passive component material, disposed in the intervals between the electrodes, wherein the passive component material connects the side surfaces of the electrodes, and wherein neither the top surface nor the bottom surface is at least partially covered by the passive component material;
• and
• a first circuit layer disposed on the dielectric layer and the electrode-patterned layer, and
• the first circuit layer is electrically connected to the electrode-patterned layer.