Lid edge capping load

A structure comprising:

• a substrate;
• a semiconductor chip on said substrate;
• a thermal interface material on said semiconductor chip;
• and
• a lid on said thermal interface material, and attached to said substrate with an adhesive;
• said lid being bowed, said thermal interface material having a center portion and end portions distal to said center portion,
• said center portion of said thermal interface material comprising more compressive stress relative to compressive stress at said end portions of said thermal interface material;
• and
• said lid comprising portions distal to said semiconductor chip, said portions distal to said semiconductor chip comprising compression marks of said lid being bent over said semiconductor chip from a force being outside of a projected area of said semiconductor chip relative to a center of said lid on either surface of said lid.

A method comprising:

• attaching a semiconductor chip to a substrate;
• applying a thermal interface material to a top of said semiconductor chip;
• positioning a lid over said semiconductor chip, said positioning of said lid over said semiconductor chip comprising connecting said lid to said semiconductor chip only using said thermal interface material;
• applying an adhesive to connect said lid to areas of said substrate outside said semiconductor chip;
• applying force to distal ends of said lid to cause a center portion of said lid to bow away from said semiconductor chip, said applying of said force comprising bending said lid being over said semiconductor chip by applying a force outside of a projected area of said semiconductor chip relative to a center of said lid;
• increasing a temperature of said thermal interface material and said adhesive to begin a curing process;
• while said center portion of said lid is bowed away from said semiconductor chip, decreasing a temperature of said thermal interface material and adhesive to complete said curing process;
• and
• after said thermal interface material has cured, removing said force from said distal ends of said lid to cause said center portion of said lid to return to a position closer to said semiconductor chip, said removing of said force causing said center portion of said thermal interface material to have more compressive stress relative to compressive stress at said end portions of said thermal interface material.